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RICHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
€3.45

RICHTEK RT8809B 08=

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LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

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i5520E SLBP6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000189
€5.40

i5-520E SLBP6 Stencil Template

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FUJITSU MB3887

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
€3.45

FUJITSU MB3887

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RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

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216LQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
€5.40

216LQA6AVA12FG Stencil Template

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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

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UNIT UTD2102CEX Digital Storage Oscilloscope 100MHZ 1G Sas USB many languages

UNI-T UTD2102CEX Oscilloscope Digital Storage 1G sample rate 100MHz bandwidth

Features:

1?Dual analog channels width range 1mV/div~20V/div;

2?7 inches widescreen LCD displays;

3?The new interface style;

4?Supports plug-and-play USB storage device. Communication with and remote control of computer through the USB device;

5?USB drive system software upgrade;

6?Storage of waveforms setups and interfaces waveforms and setups reproduction;

7?Automatic measurement of 32 waveform parameters;

8?Unique waveform recording and replay function;

9?Multilingual menu displays.

Product Specifications

Specification UTD2102CEX

Channels 2

Bandwidth 100MHz

Sample Rate 1Gs/s

Rise Time =3.5ns

Memory Depth 25kpts

Waveform Acquisition Rate =2000wfms/s

Vertical Sensitivity(V/div) 1mV/div~20V/div

Timebase Range(s/div) 2ns/div~50s/div

Storage Setup,Wave,Bitmap

Trigger Modes Edge, Pluse, Video,Slope,Alternate

Interface USB OTG

General Characteristic

Power 100-240VAC, 45-440Hz

Display 7 Inches 64K Color TFT LCD, 800480

Product Color White and Gray

Product Net Weight 2.2 Kg

Product Size (WHD) 306mm 147mm 122mm

Standard Accessories Probe2 (1,10 switchable), Power Cord , USB Cable, PC Software CD

Standard Individual Packing Gift Box, English Manual

Standard Quantity Per Carton 2 PCs

Standard Carton Measurement (LWH) 450mm 420mm 280mm

Standard Carton Cross Weight 8.5 Kg

Optional Accessories*

LA Module

Package List:

1 * UNI-T UTD 2102CEX Digital Storage Oscilloscope

2 * Probe (1,10 switchable)

1 * USB Cable

1 * Power Power Cable

1 * English Manual

1 * CD Software

CH000194
€284.69

UNI-T UTD2102CEX Digital Storage Oscilloscope 100MHZ 1G Sa/s USB many languages

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i72675QM SR02S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
€5.40

i7-2675QM SR02S Stencil Template

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INTEL LE82GME965 SLA9F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
€22.24

INTEL LE82GME965 SLA9F

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GK107250A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
€5.40

GK107-250-A2 Stencil Template

RICHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
€3.45

RICHTEK RT8809B 08=

wishlist
Compare

LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

wishlist
Compare

i5520E SLBP6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000189
€5.40

i5-520E SLBP6 Stencil Template

wishlist
Compare

FUJITSU MB3887

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
€3.45

FUJITSU MB3887

wishlist
Compare

RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

wishlist
Compare

216LQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
€5.40

216LQA6AVA12FG Stencil Template

wishlist
Compare

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

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UNIT UTD2102CEX Digital Storage Oscilloscope 100MHZ 1G Sas USB many languages

UNI-T UTD2102CEX Oscilloscope Digital Storage 1G sample rate 100MHz bandwidth

Features:

1?Dual analog channels width range 1mV/div~20V/div;

2?7 inches widescreen LCD displays;

3?The new interface style;

4?Supports plug-and-play USB storage device. Communication with and remote control of computer through the USB device;

5?USB drive system software upgrade;

6?Storage of waveforms setups and interfaces waveforms and setups reproduction;

7?Automatic measurement of 32 waveform parameters;

8?Unique waveform recording and replay function;

9?Multilingual menu displays.

Product Specifications

Specification UTD2102CEX

Channels 2

Bandwidth 100MHz

Sample Rate 1Gs/s

Rise Time =3.5ns

Memory Depth 25kpts

Waveform Acquisition Rate =2000wfms/s

Vertical Sensitivity(V/div) 1mV/div~20V/div

Timebase Range(s/div) 2ns/div~50s/div

Storage Setup,Wave,Bitmap

Trigger Modes Edge, Pluse, Video,Slope,Alternate

Interface USB OTG

General Characteristic

Power 100-240VAC, 45-440Hz

Display 7 Inches 64K Color TFT LCD, 800480

Product Color White and Gray

Product Net Weight 2.2 Kg

Product Size (WHD) 306mm 147mm 122mm

Standard Accessories Probe2 (1,10 switchable), Power Cord , USB Cable, PC Software CD

Standard Individual Packing Gift Box, English Manual

Standard Quantity Per Carton 2 PCs

Standard Carton Measurement (LWH) 450mm 420mm 280mm

Standard Carton Cross Weight 8.5 Kg

Optional Accessories*

LA Module

Package List:

1 * UNI-T UTD 2102CEX Digital Storage Oscilloscope

2 * Probe (1,10 switchable)

1 * USB Cable

1 * Power Power Cable

1 * English Manual

1 * CD Software

CH000194
€284.69

UNI-T UTD2102CEX Digital Storage Oscilloscope 100MHZ 1G Sa/s USB many languages

wishlist
Compare

i72675QM SR02S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
€5.40

i7-2675QM SR02S Stencil Template

wishlist
Compare

INTEL LE82GME965 SLA9F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
€22.24

INTEL LE82GME965 SLA9F

wishlist
Compare

GK107250A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
€5.40

GK107-250-A2 Stencil Template

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Compare
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