• Show Sidebar

There are 1325 products.

Active filters

  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: EFI Rom Cable
  • Categories: Programmer

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

N15EGTA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000288
€7.46

N15E-GT-A2 Stencil Template

N17EESA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000291
€7.46

N17E-ES-A1 Stencil Template

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTOCTO

PO000006
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTO/CTO

2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
€5.40

216-0772003 Stencil Template

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

i76700HQ SR2FQ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000304
€6.84

i7-6700HQ SR2FQ Stencil Template

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC239LLA

PO000008
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC239LL/A

GK104225A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000306
€7.46

GK104-225-A2 Stencil Template

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8800 BTOCTO

PO000009
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8800 BTO/CTO

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC408LLA

PO000010
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC408LL/A

  • -20%

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

  • -20%

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

N15EGTA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000288
€7.46

N15E-GT-A2 Stencil Template

N17EESA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000291
€7.46

N17E-ES-A1 Stencil Template

  • -20%

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTOCTO

PO000006
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTO/CTO

2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
€5.40

216-0772003 Stencil Template

  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

i76700HQ SR2FQ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000304
€6.84

i7-6700HQ SR2FQ Stencil Template

  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC239LLA

PO000008
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC239LL/A

GK104225A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000306
€7.46

GK104-225-A2 Stencil Template

  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8800 BTOCTO

PO000009
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8800 BTO/CTO

  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC408LLA

PO000010
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC408LL/A