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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer & Sockets
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A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTOCTO

PO000006
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTO/CTO

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2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
€5.40

216-0772003 Stencil Template

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC239LLA

PO000008
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC239LL/A

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i76700HQ SR2FQ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000304
€6.84

i7-6700HQ SR2FQ Stencil Template

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GK104225A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000306
€7.46

GK104-225-A2 Stencil Template

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8800 BTOCTO

PO000009
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8800 BTO/CTO

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TSOP5605TPO1NT TSOP56DIP56 Adapter

Burn seat pressure shrapnel HMILU TSOP56

Product profile:

Product use: seat, seat aging test, the IC chip of the TSOP56 test, burn

Suitable for packaging: TSOP56 pin spacing 0.5mm

Test block: TSOP56 burning seat

Description:

Model: TSOP56TSOP56-DIP56

Pin spacing (mm):0.5mm

Feet: 56

Chip size: 14mm*18mm

CH000710
€24.00

TSOP56-0.5-TPO1NT TSOP56-DIP56 Adapter

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A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTOCTO

PO000006
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTO/CTO

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2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
€5.40

216-0772003 Stencil Template

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Compare
  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

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  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC239LLA

PO000008
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC239LL/A

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i76700HQ SR2FQ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000304
€6.84

i7-6700HQ SR2FQ Stencil Template

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Compare

GK104225A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000306
€7.46

GK104-225-A2 Stencil Template

wishlist
Compare
  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8800 BTOCTO

PO000009
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8800 BTO/CTO

wishlist
Compare

TSOP5605TPO1NT TSOP56DIP56 Adapter

Burn seat pressure shrapnel HMILU TSOP56

Product profile:

Product use: seat, seat aging test, the IC chip of the TSOP56 test, burn

Suitable for packaging: TSOP56 pin spacing 0.5mm

Test block: TSOP56 burning seat

Description:

Model: TSOP56TSOP56-DIP56

Pin spacing (mm):0.5mm

Feet: 56

Chip size: 14mm*18mm

CH000710
€24.00

TSOP56-0.5-TPO1NT TSOP56-DIP56 Adapter

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