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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer Spare Part

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y51 MF865LLA

PO000028
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y51 MF865LL/A

BD82Q67 SLJ4D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000398
€5.40

BD82Q67 SLJ4D Stencil Template

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y71 BTOCTO

PO000029
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y71 BTO/CTO

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y51 MF865LLA

PO000028
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y51 MF865LL/A

BD82Q67 SLJ4D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000398
€5.40

BD82Q67 SLJ4D Stencil Template

  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y71 BTOCTO

PO000029
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y71 BTO/CTO

  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A