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FM880PAAY43KA Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000365
€9.97

FM880PAAY43KA Stencil Template 90*90

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Mechanic VC04 VCC power supply short circuit delector

A. Welcome To Choose The Production-MECHANIC

This manual will guide you how to use the production. MECHANIC reserves the right of final interpretation, including the manual, the three-package certificate and related materials.

Executive standard:DL/T 856-2018,GB/T 17478-2004

Information in this manual is subject to change without notice.

B. Product List

? Host *1

? Type-C Cable *1

? Insulated Crocodile Clips/Multimeter Pen Probe Test Cable *1

? Instructions *1

C. Function Description

This product develops a safe and efficient detector according to the maintenance master's understanding of the mainboard circuit power supply system, in which quickly troubleshooting for short circuit components of power supply cable in mainboard circuit, it contains four models (1.2V/1.8V/3.0V/3.8V) accurate voltage, current display,Built-in lithium battery, external charging port, It is a necessary tool for maintenance master to test the circuit of mobile phone.

D. Parameter

(Host Size) :85*55*35mm

(Voltage Mode) : 1.2V/1.8V/3.0V/3.8V (4 Types)

(Current): 25A (Max)

(Power) :100W (Max)

(Charging Port): Type-C(DC 5V/1A.4 hrs full charge)

(Work Time) :168 hrs

E. Operation Method

1. Turn on the power.

2. Select testing model(1.2V/1.8V/3.0V/3.8V).

3. The black crocodile clamps the negative electrode and positive connection test circuit.

4. Press the start button to complete.

F. Attention

Please pay attention to low voltage circuit, do not use overload voltage for circuit test, high voltage test low voltage circuit, may burn low voltage circuit components, please use similar or the same voltage gear for circuit test.

G. Warranty

Thank you for choosing this type of products, please read the following terms before using:

1. From purchasing date within 7 days, under normal use(Non-artificial damage),new package,not be disassemble and repaired .enjoy replacement service.

2. From purchasing date within one year, under normal use, if there are quality problem, not bedisassemble and repaired .enjoy free repair service.

3. For more than warranty, we provide a lifetime warranty service, free of labor costs, chargeonly spare parts costs.

4. Failure to present warranty card during warranty period, the company will not be a free service.

5. Users need warranty service, please contact your original sales unit.

6. When users need warranty service, please provide warranty card and purchase invoice, orreceipt of the certificate of the company seal.

7. Warranty does not include transportation costs and provide on-site service.

Note: This product contains a built-in battery

CH002499
€51.97

Mechanic VC04 VCC power supply short circuit delector

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ZM151032B1238 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000367
€5.40

ZM151032B1238 Stencil Template

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G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

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iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

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i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

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G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

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BD82Q67 SLJ4D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000398
€5.40

BD82Q67 SLJ4D Stencil Template

FM880PAAY43KA Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000365
€9.97

FM880PAAY43KA Stencil Template 90*90

wishlist
Compare

Mechanic VC04 VCC power supply short circuit delector

A. Welcome To Choose The Production-MECHANIC

This manual will guide you how to use the production. MECHANIC reserves the right of final interpretation, including the manual, the three-package certificate and related materials.

Executive standard:DL/T 856-2018,GB/T 17478-2004

Information in this manual is subject to change without notice.

B. Product List

? Host *1

? Type-C Cable *1

? Insulated Crocodile Clips/Multimeter Pen Probe Test Cable *1

? Instructions *1

C. Function Description

This product develops a safe and efficient detector according to the maintenance master's understanding of the mainboard circuit power supply system, in which quickly troubleshooting for short circuit components of power supply cable in mainboard circuit, it contains four models (1.2V/1.8V/3.0V/3.8V) accurate voltage, current display,Built-in lithium battery, external charging port, It is a necessary tool for maintenance master to test the circuit of mobile phone.

D. Parameter

(Host Size) :85*55*35mm

(Voltage Mode) : 1.2V/1.8V/3.0V/3.8V (4 Types)

(Current): 25A (Max)

(Power) :100W (Max)

(Charging Port): Type-C(DC 5V/1A.4 hrs full charge)

(Work Time) :168 hrs

E. Operation Method

1. Turn on the power.

2. Select testing model(1.2V/1.8V/3.0V/3.8V).

3. The black crocodile clamps the negative electrode and positive connection test circuit.

4. Press the start button to complete.

F. Attention

Please pay attention to low voltage circuit, do not use overload voltage for circuit test, high voltage test low voltage circuit, may burn low voltage circuit components, please use similar or the same voltage gear for circuit test.

G. Warranty

Thank you for choosing this type of products, please read the following terms before using:

1. From purchasing date within 7 days, under normal use(Non-artificial damage),new package,not be disassemble and repaired .enjoy replacement service.

2. From purchasing date within one year, under normal use, if there are quality problem, not bedisassemble and repaired .enjoy free repair service.

3. For more than warranty, we provide a lifetime warranty service, free of labor costs, chargeonly spare parts costs.

4. Failure to present warranty card during warranty period, the company will not be a free service.

5. Users need warranty service, please contact your original sales unit.

6. When users need warranty service, please provide warranty card and purchase invoice, orreceipt of the certificate of the company seal.

7. Warranty does not include transportation costs and provide on-site service.

Note: This product contains a built-in battery

CH002499
€51.97

Mechanic VC04 VCC power supply short circuit delector

wishlist
Compare

ZM151032B1238 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000367
€5.40

ZM151032B1238 Stencil Template

wishlist
Compare

G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

wishlist
Compare

iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

wishlist
Compare

i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

wishlist
Compare

G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

wishlist
Compare

BD82Q67 SLJ4D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000398
€5.40

BD82Q67 SLJ4D Stencil Template

wishlist
Compare
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