1 PCS DIP 7P Micro USB Connector V8 Port Charge Socket 3#

AF82801JIB SLB8R

Part Number AF82801JIB SLB8R Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1130

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

HP Pavilion Notebook PC Series DC Power Jack Connector: TX1000 CTO, TX1000Z CTO, TX1001XX, TX1002XX, TX1003XX, TX1017AU, TX1020EA, TX1021AU, TX1030EA, TX1040EA, TX1070BR, TX1080EA, TX1110CA, TX1110US, TX1115NR, TX1119US, TX1120US, TX1127CL, TX1200 CTO, TX1201XX, TX1202AU, TX1202XX, TX1205US, TX1206AU, TX1208CA, TX1210CA, TX1210US, TX1215NR, TX1217CL, TX1218AU, TX1218CA, TX1219US, TX1220AU, TX1220CA, TX1220US, TX1228CA, TX1230LA, TX1232LA, TX1304AU, TX1304CA, TX1305AU, TX1305CA, TX1305US, TX1306NR, TX1307AU, TX1308CA, TX1308NR, TX1313AU, TX1314AU, TX1314CA, TX1315AU, TX1316AU, TX1317AU, TX1318AU, TX1318CA, TX1319AU, TX1320AU, TX1320CA, TX1320US, TX1321AU, TX1325NR, TX1327CL, TX1330LA, TX1332LA, TX1400 CTO, TX1401AU, TX1403AU, TX1404AU, TX1410US, TX1414CA, TX1416CA, TX1417CL, TX1418CA, TX1419NR, TX1420CA, TX1420US, TX1499US

HP Pavilion TX2000 Series Entertainment Notebook PC DC Power Jack Connector: TX2000 CTO, TX2000Z CTO, TX2002AU, TX2003AU, TX2005AU, TX2006AU, TX2008AU, TX2010AU, TX2013AU, TX2014AU, TX2015AU, TX2016AU, TX2018AU, TX2019AU, TX2020AU, TX2021AU, TX2023AU, TX2024AU, TX2025AU, TX2026AU, TX2027AU, TX2030AU, TX2031AU, TX2032LA, TX2033AU, TX2051XX, TX2052XX, TX2053XX, TX2054XX, TX2104AU, TX2104CA, TX2105 CTO, TX2105AU, TX2106AU, TX2107AU, TX2108AU, TX2108CA, TX2109AU, TX2110AU, TX2110CA, TX2110US, TX2113CL, TX2114CA, TX2115NR, TX2117CL, TX2120US, TX2151XX, TX2152XX, TX2500 CTO, TX2500z CTO, TX2501AU, TX2504AU, TX2507AU, TX2508AU, TX2508CA, TX2510AU, TX2510CA, TX2511AU, TX2512AU, TX2513AU, TX2513CL, TX2514AU, TX2514CA, TX2516AU, TX2517AU, TX2517CA, TX2517CL, TX2518AU, TX2519AU, TX2520AU, TX2521AU, TX2524CA, TX2525AU, TX2525NR, TX2526AU, TX2527AU, TX2528AU, TX2532AU, TX2534AU, TX2551XX, TX2552XX, TX2601AU, TX2604AU, TX2604CA, TX2605AU, TX2608AU, TX2608CA, TX2609AU, TX2610AU, TX2611AU, TX2612AU, TX2614AU, TX2615AU, TX2616AU, TX2617CA, TX2622NR, TX2623CA, TX2635US, TX2697CL

HP TouchSmart TX2 Series DC Power Jack Connector: TX2-1002AU, TX2-1012NR, TX2-1016AU, TX2-1017AU, TX2-1018AU, TX2-1019AU, TX2-1020AU, TX2-1020CA, TX2-1020US, TX2-1022AU, TX2-1024CA, TX2-1025DX, TX2-1027CA, TX2-1030CM, TX2-1031CM, TX2-1032CM, TX2-1051XX, TX2-1070BR, TX2-1102AU, TX2-1103AU, TX2-1104AU, TX2-1105AU, TX2-1106AU, TX2-1107AU, TX2-1108AU, TX2-1109AU, TX2-1110AU, TX2-1118AU, TX2-1120AU, TX2-1122AU, TX2-1205AU, TX2-1207AU, TX2-1208AU, TX2-1209AU, TX2-1270US, TX2-1274NR, TX2-1277NR, TX2-1305AU, TX2-1307AU, TX2-1308AU, TX2-1310AU, TX2-1323AU, TX2-1326AU, TX2-1370US, TX2-1375DX, TX2-1377NR, TX2z-1000 CTO, TX2Z-1300 CTO

SR1EB i7-4510U

Part Number SR1EB i7-4510U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1330

Package/Case 440 PCS Description Original new

SR1EB i7-4510U CL8064701477301 Intel Core i7 Mobile CPU BGA1168 2.0 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Asus EEE PC Disney MK90 Series DC Power Jack Connector: MK90, MK90H

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Asus A52 Series DC Power Jack Connector: A52x-xxxx, A52F, A52F-XA1, A52F-XA2, A52F-XA3, A52F-XA4, A52F-XA5, A52F-XE, A52F-XE1, A52F-XE2, A52F-XE3, A52F-XE4, A52F-XE5, A52F-XE6, A52F-XT1, A52F-XT1R, A52F-XT2, A52F-XT22

Asus A53 Series DC Power Jack Connector: A53x-xxxx, A53E, A53E-A1B, A53E-AH51, A53E-AS51, A53E-EH31, A53E-EH71, A53E-EH91, A53E-ES31, A53E-ES71, A53E-NH51, A53E-TH52, A53E-TS52, A53E-XA1, A53E-XA2, A53E-XE1, A53E-XE2, A53E-XE3, A53E-XN1, A53E-XT2, A53E-XT3, A53E-XT4, A53SV-xxxx, A53SV, A53SV-EH7, A53SV-EH71, A53SV-NH5, A53SV-NH51, A53SV-NH71, A53SV-TH71, A53SV-TH72, A53SV-XE2, A53SV-XN1, A53SV-XC1, A53SV-XE1, A53SV-XE2, A53SV-XN1, A53SV-XT1, A53SV-XT2, A53TA-xxx, A53TA, A53TA-XE2, A53TA-XN1, A53U-xxxx, A53Ux, A53U-EH11, A53U-EH21, A53U-EH22, A53U-ES01, A53U-ES11, A53U-ES21, A53U-XA1, A53U-XE1, A53U-XE2, A53U-XE3, A53U-XT2

Asus K52 Series DC Power Jack Connector: K52x-xxxx, K52F, K52F-A1, K52F-B1, K52F-BBR5, K52F-BBR9, K52F-BIN6, K52F-C1, K52F-C2B, K52F-D1, K52J, K52JB, K52JC, K52JC-A1, K52JC-B1, K52JC-X1, K52JC-X2, K52JC-XN1, K52JE, K52JE-XN1, K52JK, K52JK-A1, K52JR, K52JR-X2, K52JR-X4, K52JR-X5, K52JT, K52JT-A1, K52JT-B1, K52JT-XT1, K52JT-XT1R

Asus K53 Series DC Power Jack Connector: K53x-xxxx, K53E, K53E-BD4TD, K53E-BBR11, K53E-BBR14, K53E-BBR4, K53E-BBR7, K53E-BBR9, K53E-DH31, K53E-DH51, K53E-DH52, K53E-DH91, K53E-DS31, K53E-DS52, K53E-DS91, K53E-RBR4, K53E-RBR5, K53E-RBR9, K53E-RIN5, K53E-XB1, K53E-XB2, K53E-XR1, K53E-XR4, K53E-XQ2, K53SD-xxxx, K53SD, K53SD-DS51, K53SD-DS71, K53SD-SX039V, K53SD-SX101V, K53SD-SX111D, K53SD-SX132V, K53SD-SX504V, K53SD-SX656, K53SV-xxxx, K53SV, K53SV-A1, K53SV-B1, K53SV-DH51, K53SV-DH71, K53SV-XR1, K53SV-XR2, K53SV-XP1, K53TA-xxxx, K53TA, K53TA-A1, K53TA-BBR6, K53TA-1BSX, K53U-xxxx, K53U, K53U-A1, K53U-DH21, K53U-RBR5, K53U-RBR5, K53U-RBR7, K53U-YH21, K53U-1BSX,

Asus U52 Series DC Power Jack Connector: U52x-xxxx, U52F, U52F-BBG6, U52F-BBL5, U52F-BBL9

Asus X52 Series DC Power Jack Connector: X52x-xxx, X52F, X52F-X1, X52F-X2, X52F-X3, X52F-XF1, X52F-XF2, X52F-XR4, X52F-XR6, X52F-XR7, X52F-XR9

Fujitsu Amilo DC Power Jack Connector: M1405, M7405, Pro V2040

IBM ThinkPad X40 Series DC Power Jack Connector: X40, X41, X42, X43, X44, X45

Motion Computing DC Power Jack Connector: LE 1600

Seneca Data Nexlink Carbon 4200 Series DC Power Jack Connector: 4200, 4225

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR2Z6 N3450

Part Number SR2Z6 N3450 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Acer Aspire DC Power Jack Connector: 1350

Acer Ferrari DC Power Jack Connector: 3000, 3000LMI, 3200, 3400, 4000

Acer Travlemate DC Power Jack Connector: 2700, 4500

Asus DC Power Jack Connector: A2500H Series

Chembook DC Power Jack Connector: CQ12-15

Dell Inspiron DC Power Jack Connector: 1000, 1200, 1300, 2000, 2200, B120, B130

Medion DC Power Jack Connector: E6214

Toshiba Satellite DC Power Jack Connector: 1130 Series, 1135 Series, 2430 Series, 2435 Series

Packard Bell EasyNote: C3 Series, C3205, C3223, C3227, C3255, C3265, C3300, C3302

ASUS Eee PC EEEPC X101H X101CH R11CX R 11CX DC Jack Power Port Socket Connector

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock