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RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
€3.45

RICHTEK RT8152A

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TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

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NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

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apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

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PEB1 Expansion board Support IT8587E IT8586E IT8580x809F

PEB-1 Expansion board Support IT8587E IT8586E IT8580E 29/39/49/50 series 32/40/48 feet

Part Number PEB-1 Expansion board Manufacturer iFix

Type Expansion board Matching Date Code 17+

Package/Case 1 PCS Description Original new

Packing Include:

1. PEB-1 Expansion board 1pcs

2. TSOP VSOP/SOP/simple adapter plate 1PCS

3. IT85 series simple adapter plate 1PCS

4. FFC Line 200MM 0.5mm-32P 1pcs

5. FFC Line 200MM 1.0mm-32P 1pcs

6. FPC Base Under 0.5mm-32P 1pcs

7. FPC Base Under 1.0mm-32P 1pcs

CH000893
€33.44

PEB-1 Expansion board Support IT8587E IT8586E IT8580E 29/39/49/50 series 32/40/48 feet for RT809F

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TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

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XELTEK SuperPro 7500 High Speed StandAlone Universal Device Programmer

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer:

Login to Download: Download software

Features:

> Until now,Support 310 IC manufacturer, 77083 pcs devices and keeps growing.

> Support devices with Vcc from 1.2V to 5V.

> The programming speed up further increase 30% compared to SUPERPRO 5000.

> The programmer support files up to 256 GBytes

> Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

> PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.

User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode.

> Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.

> Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

> ver-current and over-voltage protection for safety of the chip and programmer hardware.

> WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility

Program Speed table

Manufacturer Device 3968MB (P+V) 1984MB (P+V) 1024MB (P+V)

TOSHIBA THGBM6D1KBAIL 221s 98 s 52 s

SANDISK SDIN7DU2-32G 314 s 155 s 56 s

SAMSUNG KLMCG8GE4A 320 s 158 s 58 s

SAMSUNG KLMAG4FEKA 318 s 160 s 62 s

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

Hardware & Electrical Specifications:

Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...

PC interface: USB2.0 LAN

Stand-alone Feature: Supported, SD Card .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/1.5A; power:15W

Mechanical parameter: Main unit: Size: 181*138*90 mm Weight: 1.2Kg.

Packing Box: Size 310*240*140 mm Weight: 1.9 Kg.

Accessories:

Main unit, AC adaptor, USB2.0 cable, software CD (user manual), register card

Optional accessories: ZIF48 Socket, adaptor in varies packages, SD card for stand-alone operation.

CH000906
€1,799.00

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer

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ITE IT8512E NXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000389
€3.45

ITE IT8512E NXS

RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
€3.45

RICHTEK RT8152A

wishlist
Compare

TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

wishlist
Compare

NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

wishlist
Compare

apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

wishlist
Compare

PEB1 Expansion board Support IT8587E IT8586E IT8580x809F

PEB-1 Expansion board Support IT8587E IT8586E IT8580E 29/39/49/50 series 32/40/48 feet

Part Number PEB-1 Expansion board Manufacturer iFix

Type Expansion board Matching Date Code 17+

Package/Case 1 PCS Description Original new

Packing Include:

1. PEB-1 Expansion board 1pcs

2. TSOP VSOP/SOP/simple adapter plate 1PCS

3. IT85 series simple adapter plate 1PCS

4. FFC Line 200MM 0.5mm-32P 1pcs

5. FFC Line 200MM 1.0mm-32P 1pcs

6. FPC Base Under 0.5mm-32P 1pcs

7. FPC Base Under 1.0mm-32P 1pcs

CH000893
€33.44

PEB-1 Expansion board Support IT8587E IT8586E IT8580E 29/39/49/50 series 32/40/48 feet for RT809F

wishlist
Compare

TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

wishlist
Compare

XELTEK SuperPro 7500 High Speed StandAlone Universal Device Programmer

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer:

Login to Download: Download software

Features:

> Until now,Support 310 IC manufacturer, 77083 pcs devices and keeps growing.

> Support devices with Vcc from 1.2V to 5V.

> The programming speed up further increase 30% compared to SUPERPRO 5000.

> The programmer support files up to 256 GBytes

> Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

> PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.

User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode.

> Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.

> Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

> ver-current and over-voltage protection for safety of the chip and programmer hardware.

> WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility

Program Speed table

Manufacturer Device 3968MB (P+V) 1984MB (P+V) 1024MB (P+V)

TOSHIBA THGBM6D1KBAIL 221s 98 s 52 s

SANDISK SDIN7DU2-32G 314 s 155 s 56 s

SAMSUNG KLMCG8GE4A 320 s 158 s 58 s

SAMSUNG KLMAG4FEKA 318 s 160 s 62 s

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

Hardware & Electrical Specifications:

Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...

PC interface: USB2.0 LAN

Stand-alone Feature: Supported, SD Card .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/1.5A; power:15W

Mechanical parameter: Main unit: Size: 181*138*90 mm Weight: 1.2Kg.

Packing Box: Size 310*240*140 mm Weight: 1.9 Kg.

Accessories:

Main unit, AC adaptor, USB2.0 cable, software CD (user manual), register card

Optional accessories: ZIF48 Socket, adaptor in varies packages, SD card for stand-alone operation.

CH000906
€1,799.00

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer

wishlist
Compare

ITE IT8512E NXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000389
€3.45

ITE IT8512E NXS

wishlist
Compare
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