XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer:

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Features:

> Until now,Support 310 IC manufacturer, 77083 pcs devices and keeps growing.

> Support devices with Vcc from 1.2V to 5V.

> The programming speed up further increase 30% compared to SUPERPRO 5000.

> The programmer support files up to 256 GBytes

> Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

> PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.

User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode.

> Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.

> Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

> ver-current and over-voltage protection for safety of the chip and programmer hardware.

> WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility

Program Speed table

Manufacturer Device 3968MB (P+V) 1984MB (P+V) 1024MB (P+V)

TOSHIBA THGBM6D1KBAIL 221s 98 s 52 s

SANDISK SDIN7DU2-32G 314 s 155 s 56 s

SAMSUNG KLMCG8GE4A 320 s 158 s 58 s

SAMSUNG KLMAG4FEKA 318 s 160 s 62 s

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

Hardware & Electrical Specifications:

Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...

PC interface: USB2.0 LAN

Stand-alone Feature: Supported, SD Card .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/1.5A; power:15W

Mechanical parameter: Main unit: Size: 181*138*90 mm Weight: 1.2Kg.

Packing Box: Size 310*240*140 mm Weight: 1.9 Kg.

Accessories:

Main unit, AC adaptor, USB2.0 cable, software CD (user manual), register card

Optional accessories: ZIF48 Socket, adaptor in varies packages, SD card for stand-alone operation.

AF82801JIB SLB8R

Part Number AF82801JIB SLB8R Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1130

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR1EB i7-4510U

Part Number SR1EB i7-4510U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1330

Package/Case 440 PCS Description Original new

SR1EB i7-4510U CL8064701477301 Intel Core i7 Mobile CPU BGA1168 2.0 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OTS-16-03 Programmer Adapter SOP8-DIP8 Socket (150mil)

SOP44 to DIP48 Programmer Converter Adapter Socket SOP44-1.27-TP01NT for TL866CS TL866A TL866II

Part Number SOP44-1.27-TP01NT Manufacturer XinGong TECH

Type SOP44 to DIP48 Date Code 16+

Package/Case 1 PCS Adapters Description Original new

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Limit frame specification: 10.5*13mm

SR2Z6 N3450

Part Number SR2Z6 N3450 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Package type TQFP112

Adapter type COVER

Spacing 0.65mm

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

eMMC153/169 test socket USB Reader IC size 11.5x13mm nand flash test

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Limit frame specification: 11.5*13mm

Buy Limit Frame: * 12*16mm, 12*18mm, 14*18mm

Description:

BGA169/BGA153 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 11.5x13mm

It is designed for test, debug, validation, data recovery and programming of eMMC.

It provides a compact test solution for eMMC used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC devices.

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

Feature:

1) This eMMC socket is for BGA 169 and BGA 153 testing.

2) The main control chip is ITE IT1327, which is a USB 2.0 with multi partition of SD/MMC card reader controller, T1327 built-in SD/MMC card power supply. It also integrates 5v to 3.3v voltage regulator, high speed USB 2.0 interface and downward compatible with USB 1.1.

3) Support hot swap and a separate power supply switch.

4) Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

5) eMMC data could be read and written fastly.

6) With 30 pins and pin pictch 0.5mm.

7) eMMC size of this product is 11.5x13mm , we also provide size 12x16mm ,12x18mm , 14x18mm , please see more products in our store .

Apply to eMMC thickness of 0.8mm and 1.5mm.

Just insert the USB into your PC, it is easy use.

Accurate positioning on flat bottom pad and solder of eMMC.

Life cycle is around 25,000 times.