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N12EGTXA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001314
€5.47

N12E-GTX-A1 Stencil Template

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TI BQ24196B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001315
€3.45

TI BQ24196B

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KESS V2 OBD2 V5017 EU Version SW V253

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

CH001316
€94.48

KESS V2 OBD2 V5.017 EU Version SW V2.53

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15ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.54inch/9cm

Width: approx. 1.26inch/3.2cm

Model: B-7000

Net weight: 0.5fl.oz (15ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001317
€3.73

15ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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2150821330 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001318
€5.40

215-0821330 Stencil Template

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MCP77MVA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001319
€5.40

MCP77MV-A2 Stencil Template

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Lenovo Yoga 3 Pro Yoga 3 Pro1370 Only for Core i3 i5 40W Charger AC Adapter

Tech Specs:

Product Description: AC Adapter - power adapter - 40 Watt

Device Type: Power adapter

Input voltage:100V-240V 50-60Hz

Output voltage: 20V/5.2V

Output current: 2A

Power Capacity: 40W

Package Included:1 X AC Adapter, 1 X Power Cord

Compatibility:

- Delta: ADL40WDA 36200561, ADL40WDJ 36200562, ADL40WDB 36200563, ADL40WDD 36200564, ADL40WDG 36200565, ADL40WDE 36200566, ADL40WDC 36200567, ADL40WDH 36200616

- Chicony: ADL40WCA 36200579, ADL40WCB 36200580, ADL40WCC 36200581, ADL40WCD 36200582, ADL40WCE 36200583, ADL40WCF 36200584, ADL40WCG 36200585, ADL40WCH 36200618

- Liteon: ADL40WLA 36200572, ADL40WLB 36200573, ADL40WLC 36200574, ADL40WLD 36200575, ADL40WLE 36200576, ADL40WLF 36200577, ADL40WLG 36200578, ADL40WLH 36200617

- Model: GX20H34904, 80HE0049US

- Yoga 3 Pro, Yoga 3 Pro-1370 (Only for Core i3, i5)

- Yoga 3 11, Yoga 3-1170 (For Core i3, i5, i7)

- Yoga 3 14, Yoga 3-1470 (Only for Core i3)

CH001320
€23.37

Lenovo Yoga 3 Pro Yoga 3 Pro-1370 (Only for Core i3 i5) 40W Charger AC Adapter

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Power supply IBMLENOVO 20V 325A 65W 55x25

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

Input Voltage Range AC 100V - 240V Output 20V 3.25A

Connector Size 5.5mm*2.5mm Power 65W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001321
€11.81

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

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RICHTEK RT9711AGF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001322
€3.45

RICHTEK RT9711AGF

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Maxim MAX1988

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001323
€3.45

Maxim MAX1988

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TOSHIBA TC7SH08F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001324
€3.45

TOSHIBA TC7SH08F

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GM206300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001325
€6.47

GM206-300-A1 Stencil Template

N12EGTXA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001314
€5.47

N12E-GTX-A1 Stencil Template

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Compare

TI BQ24196B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001315
€3.45

TI BQ24196B

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Compare

KESS V2 OBD2 V5017 EU Version SW V253

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

CH001316
€94.48

KESS V2 OBD2 V5.017 EU Version SW V2.53

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15ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.54inch/9cm

Width: approx. 1.26inch/3.2cm

Model: B-7000

Net weight: 0.5fl.oz (15ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001317
€3.73

15ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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2150821330 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001318
€5.40

215-0821330 Stencil Template

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Compare

MCP77MVA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001319
€5.40

MCP77MV-A2 Stencil Template

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Lenovo Yoga 3 Pro Yoga 3 Pro1370 Only for Core i3 i5 40W Charger AC Adapter

Tech Specs:

Product Description: AC Adapter - power adapter - 40 Watt

Device Type: Power adapter

Input voltage:100V-240V 50-60Hz

Output voltage: 20V/5.2V

Output current: 2A

Power Capacity: 40W

Package Included:1 X AC Adapter, 1 X Power Cord

Compatibility:

- Delta: ADL40WDA 36200561, ADL40WDJ 36200562, ADL40WDB 36200563, ADL40WDD 36200564, ADL40WDG 36200565, ADL40WDE 36200566, ADL40WDC 36200567, ADL40WDH 36200616

- Chicony: ADL40WCA 36200579, ADL40WCB 36200580, ADL40WCC 36200581, ADL40WCD 36200582, ADL40WCE 36200583, ADL40WCF 36200584, ADL40WCG 36200585, ADL40WCH 36200618

- Liteon: ADL40WLA 36200572, ADL40WLB 36200573, ADL40WLC 36200574, ADL40WLD 36200575, ADL40WLE 36200576, ADL40WLF 36200577, ADL40WLG 36200578, ADL40WLH 36200617

- Model: GX20H34904, 80HE0049US

- Yoga 3 Pro, Yoga 3 Pro-1370 (Only for Core i3, i5)

- Yoga 3 11, Yoga 3-1170 (For Core i3, i5, i7)

- Yoga 3 14, Yoga 3-1470 (Only for Core i3)

CH001320
€23.37

Lenovo Yoga 3 Pro Yoga 3 Pro-1370 (Only for Core i3 i5) 40W Charger AC Adapter

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Power supply IBMLENOVO 20V 325A 65W 55x25

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

Input Voltage Range AC 100V - 240V Output 20V 3.25A

Connector Size 5.5mm*2.5mm Power 65W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001321
€11.81

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

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Compare

RICHTEK RT9711AGF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001322
€3.45

RICHTEK RT9711AGF

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Compare

Maxim MAX1988

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001323
€3.45

Maxim MAX1988

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Compare

TOSHIBA TC7SH08F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001324
€3.45

TOSHIBA TC7SH08F

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Compare

GM206300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001325
€6.47

GM206-300-A1 Stencil Template

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