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i74710HQ SR1PX Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001350
€8.70

i7-4710HQ SR1PX Stencil Template

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Diodes AP4415GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001352
€3.45

Diodes AP4415GM

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HM6264ALP12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001353
€3.45

HM6264ALP-12

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MASTECH MAS830L DMM Digital Multimeters DC Current Resistance ACDC Volotage

Features:

Display: 1999 counts with backlight

hFE: 1 ~ 1000

Diode/continuity test

Data hold

Fuse Protection

Overrange indication

Polartiy indication

Specifications:

DC voltage: 200mV/2V/20V/200V 0.5%+3

600V 0.8%+5

AC voltage: 200V /600V 1.2%+10

DC current: 200A/2mA /20mA 1.0%+3

200mA 1.5%+5,

10A 3.0%+10

Resistance: 200O 0.8%+5

2kO/20kO/200kO 0.8%+2

2MO 1.0%+5

General characteristics:

Power: 6F22 (9V) * 1 ( included)

Product Size: 138mm * 69mm * 31mm

Product Weight: Approx. 170g

Product color: Green & black

Package Size: 16 * 11 * 5cm / 6.4 * 4.3 * 2in

Package Weight: 301g / 10.6oz

Package List:H12474 *1 / MAS830L

1 * MASTECH MAS830L Digital Multimeter

1 * Pair Test Lead

1 * User Manual

CH001354
€11.81

MASTECH MAS830L DMM Digital Multimeters DC Current Resistance AC/DC Volotage

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Screen ProtectionRemoval High Temperature Resistance Screen Refurbish Tape 80mm50m

Screen protection/removal high temperature resistance screen refurbish tape 80mm by 50 meter

80MM x 50 meter

very useful tape , only to be used for screen removal , high temperature resistance

you can use it for cleaning dust or micro parts as well

simply apply the tape before heating process ,keep it all in one piece

CH001355
€6.09

Screen Protection/Removal High Temperature Resistance Screen Refurbish Tape 80mm*50m

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2160810001 HD6770

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001356
€31.35

216-0810001 HD6770

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CONEXANT CX2058411Z

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001357
€3.45

CONEXANT CX20584-11Z

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MCP79MVLB2

MCP79MVL-B2

Part Number MCP79MVL-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001359
€25.93

MCP79MVL-B2

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2150910052 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001360
€6.71

215-0910052 Stencil Template

i74710HQ SR1PX Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001350
€8.70

i7-4710HQ SR1PX Stencil Template

wishlist
Compare

Diodes AP4415GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001352
€3.45

Diodes AP4415GM

wishlist
Compare

HM6264ALP12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001353
€3.45

HM6264ALP-12

wishlist
Compare

MASTECH MAS830L DMM Digital Multimeters DC Current Resistance ACDC Volotage

Features:

Display: 1999 counts with backlight

hFE: 1 ~ 1000

Diode/continuity test

Data hold

Fuse Protection

Overrange indication

Polartiy indication

Specifications:

DC voltage: 200mV/2V/20V/200V 0.5%+3

600V 0.8%+5

AC voltage: 200V /600V 1.2%+10

DC current: 200A/2mA /20mA 1.0%+3

200mA 1.5%+5,

10A 3.0%+10

Resistance: 200O 0.8%+5

2kO/20kO/200kO 0.8%+2

2MO 1.0%+5

General characteristics:

Power: 6F22 (9V) * 1 ( included)

Product Size: 138mm * 69mm * 31mm

Product Weight: Approx. 170g

Product color: Green & black

Package Size: 16 * 11 * 5cm / 6.4 * 4.3 * 2in

Package Weight: 301g / 10.6oz

Package List:H12474 *1 / MAS830L

1 * MASTECH MAS830L Digital Multimeter

1 * Pair Test Lead

1 * User Manual

CH001354
€11.81

MASTECH MAS830L DMM Digital Multimeters DC Current Resistance AC/DC Volotage

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Screen ProtectionRemoval High Temperature Resistance Screen Refurbish Tape 80mm50m

Screen protection/removal high temperature resistance screen refurbish tape 80mm by 50 meter

80MM x 50 meter

very useful tape , only to be used for screen removal , high temperature resistance

you can use it for cleaning dust or micro parts as well

simply apply the tape before heating process ,keep it all in one piece

CH001355
€6.09

Screen Protection/Removal High Temperature Resistance Screen Refurbish Tape 80mm*50m

wishlist
Compare

2160810001 HD6770

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001356
€31.35

216-0810001 HD6770

wishlist
Compare

CONEXANT CX2058411Z

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001357
€3.45

CONEXANT CX20584-11Z

wishlist
Compare

MCP79MVLB2

MCP79MVL-B2

Part Number MCP79MVL-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001359
€25.93

MCP79MVL-B2

wishlist
Compare

2150910052 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001360
€6.71

215-0910052 Stencil Template

wishlist
Compare
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