Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * User Manual Buy Probe Accessories

Description

Hantek 6102BE PC USB Digital Storage Oscilloscope 100Mhz 2CH and EXT 250MS/s

Features:

Excellent industrial design-the same anodised aluminium casing as iPad,

which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface,

and has good heat resistance and strong wearability.

Standard USBXI TM interface, easily inserts into USBXI TM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance,be used easily on business.

Dimensions (mm):190(L) x100(W) x35(H), be carried easily.

High performance, 250MS/s real-time sampling, 100MHz Bandwidth.

Operating System: Windows 7, Windows NT, Windows 2000, Windows XP,VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity,invert,addition, subtraction, multiplication, division,X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

LabviewVBVCDelphiC++Builder Second Design instance.

Specifications Table:

Input

Max. sample rate

Real-time sampling:

250MSa/s using one channel(Hantek6102BE)

250MSa/s using one channel(Hantek6212BE)

Channels

2

Bandwidth

100 MHz analog bandwidth(Hantek6102BE)

200 MHz analog bandwidth(Hantek6212BE)

Vertical Resolution

8 bits/channel (Hantek6102BE)

9 bits/channel (Hantek6212BE)

Gain range

Hantek6102BE

10mV ~5V/div @ x1 probe(1,2,5 sequence)

100mV ~ 50V/div @ x10 probe

1V ~ 500V/div @ x100 probe

10V ~ 5KV/div @ x1000 probe

Hantek6212BE

10mV ~10V/div @ x1 probe(1,2,5 sequence)

100mV ~100V/div @ x10 probe

1V ~ 1000V/div @ x100 probe

10V ~ 10KV/div @ x1000 probe

Range

8 divisions

Offset level

+/-4 divisions

Coupling

AC, DC,GND

Offset increments

0.02 div

Impedance

1M ohm

DC accuracy

+/-3%

Input protection

35Vpk (DC + peak AC < 10 kHz, without external attenuation)

Display Mode

Y-T, X-Y and Roll

Timebase

Timebase range

Hantek6102BE

4ns/div-1h/div(1-2-4 sequence)

Hantek6212BE

2ns/div-1h/div(1-2-4 sequence)

Acquisition mode

Hantek6102BE

Real-time sampling: 4ns/div-400ms/div.

Roll mode: 1s/div-1h/div

Hantek6212BE

Equivalent sampling: 2ns/div ~ 4us/div

Real-time sampling: 10us/div ~ 400ms/div

Roll mode: 1s/div ~ 1h/div

Range

10 divisions

Buffer Size

10K ~ 1M

Trigger

Type

Hantek6102BE

Edge trigger

Hantek6212BE

Edge trigger, Pulse Trigger

Mode

Auto, Normal and Single

Freescale USBDM 8/16/32 bit 3 in 1 Emulator

Login to Download: Download software

Features:

1. SupportFull range of HCS08 , HCS12 (X) full range , Coldfire V1 full range, Can be downloaded online , single-step debugging , simulation, observe all registers and global variables values

2. Support the development environment :

CodeWarrior V10.1 V10.2

CodeWarrior V5.0 V5.1 (16Bit microcontroller development environment)

CodeWarrior V6.2 V6.3(8Bit microcontroller development environment)

3. Environment : WINXP / WIN7 32/64 bit

4.BDM clock up40M

5. Support FirmwareOnline Upgrade

6.BDM interface is the official standard version , is defined as follows :

1.BKGD 3.NC 5.NC

2.GND 4.RST 6.VDD

Support chips:

HCS08 8Full range of

MC9S08AC128, MC9S08AC16, MC9S08AC32, MC9S08AC48, MC9S08AC60, MC9S08AC8, MC9S08AC96, MC9S08AW16, MC9S08AW16A, MC9S08AW32, MC9S08AW48, MC9S08AW60, MC9S08AW8A

MC9S08DE32, MC9S08DE60, MC9S08DN16, MC9S08DN32, MC9S08DN48, MC9S08DN60, MC9S08DV128, MC9S08DV16, MC9S08DV32, MC9S08DV48, MC9S08DV60, MC9S08DV96, MC9S08DZ128, MC9S08DZ16, MC9S08DZ32, MC9S08DZ48, MC9S08DZ60, MC9S08DZ96

MC9S08EN16, MC9S08EN32

MC9S08EL16, MC9S08EL32

MC9S08GB32, MC9S08GB32A, MC9S08GB60, MC9S08GB60A, MC9S08GT16, MC9S08GT16A, MC9S08GT32, MC9S08GT32A, MC9S08GT60, MC9S08GT60A, MC9S08GT8A

MC9S08JM16, MC9S08JM32, MC9S08JM60, MC9S08JM8

MC9S08JR12

MC9S08LC36, MC9S08LC60

MC9S08QA4, MC9S08QD2, MC9S08QD4, MC9S08QE128, MC9S08QE16, MC9S08QE32, MC9S08QE32, MC9S08QE4, MC9S08QE64, MC9S08QE8, MC9S08QE96, MC9S08QG4, MC9S08QG8

MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RC8, MC9S08RD16, MC9S08RD32, MC9S08RD60, MC9S08RD8, MC9S08RE16, MC9S08RE32, MC9S08RE60, MC9S08RE8, MC9S08RG32, MC9S08RG60

MC9S08SG16, MC9S08SG32, MC9S08SG4, MC9S08SG8

MC9S08SH16, MC9S08SH32, MC9S08SH4, MC9S08SH8

MC9S08SLL16, MC9S08SLL8

HCS12 (X) 16Full range of

MC9S12A128B, MC9S12A256B, MC9S12A32, MC9S12A64, MC9S12A512

MC9S12B64, MC9S12B128

MC9S12C32, MC9S12C64, MC9S12C96

MC9S12D32, MC9S12D64, MC9S12DB128A, MC9S12DB128B, MC9S12DG128B, MC9S12DG256B, MC9S12DJ128B, MC9S12DJ256B, MC9S12DJ64, MC9S12DP256B, MC9S12DJ64, MC9S12DP256B, MC9S12DP512, MC9S12DT128B, MC9S12DT256, MC9S12DT256B

MC9S12E32, MC9S12E64, MC9S12E128, MC9S12E256

MC9S12G96, MC9S12G128

MC9S12GC16, MC9S12GC32, MC9S12GC128

MC9S12H128, MC9S12H256, MC9S12HN64, MC9S12HZ64, MC9S12HZ128, MC9S12HZ256

MC9S12HA32, MC9S12HA48, MC9S12HZ64

MC9S12HY32, MC9S12HY48, MC9S12HY64

MC9S12I32, MC9S12I128

MC9S12KC64, MC9S12KC128, MC9S12KG64, MC9S12KG128, MC9S12KG256, MC9S12KL64, MC9S12KL128, MC9S12KT128, MC9S12KT256

MC9S12NE64

MC9S12P32, MC9S12P64, MC9S12P96, MC9S12P128

MC9S12Q32, MC9S12Q64, MC9S12Q96, MC9S12Q128

MC9S12T64

MC9S12UF32

MC9S12XA128, MC9S12XA256, MC9S12XA512

MC9S12XB128, MC9S12XB256

MC9S12XD64, MC9S12XD128, MC9S12XD256, MC9S12XDG128, MC9S12XDP512, MC9S12XDQ256, MC9S12XDT256, MC9S12XDT384, MC9S12XDT512

MC9S12XEG128, MC9S12XEP100, MC9S12XEP768, MC9S12XEQ384, MC9S12XEQ512, MC9S12XET256

MC9S12XFR128

MC9S12XHY128, MC9S12XHY256

MC9S12XS64, MC9S12XS128, MC9S12XS256

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OTS-20-1.27-01 Programmer Adapter Double SOP8-DIP8(SOP16-DIP20)Socket (200mil)

DT71 intelligent Mini Digital tweezers hand-held bridge measurement LCR DVF components signal generator multimeter

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR32Q i7-7700HQ

Part Number i7-7700HQ SR32Q Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1440 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Notice:This is HC-05 Bluetooth module Slave and master two in one module~

This module can be set to a transmitter or receiver, transmitter could pairing with receiver , receiver and receiver or transmitter and transmitter can't communication between, receiver could pairing with computers and cell phone Bluetooth , when buying, the default for receiver.

Specification:

1. Use the CSR mainstream bluetooth chip, bluetooth V2.0 protocol standards.

2. Module working voltage 3.3 V.

3. Default potter rate is 9600, can be set up from 2400 to 115200 .

4. The core module size : 28 mm x 15 mm x 2.35 mm.

5. Working current: matching for 30 MA, matching the communication for 8 MA.

6. Dormancy current: no dormancy.

7. Used for GPS navigation system, water and electricity gas meter reading system.

8. With computer and bluetooth bluetooth adapter, PDA, seamless connection equipment

Highlights:

1. Commercial Series: Bluetooth module board Series

2. With LED indicator light, use 150mA and 3.3V regulation chip.

3. With VCC?GND?TXD?RXD foot for the Bluetooth

4. With "Re-seach" button(ON/OFF/WAKE foot for it , external MCU outinput "High level" can control module to re-search)

5. Compatible with bluetooth master module", slave module"or master-slave(whole) module.

6. put voltage: 3.3~6V

7. Size: 1.55cm*3.98cm

Note:

1. input power supply 3.3~6V, Prohibit more than 7V

2. No "Automatically prevent power supply peversing func", so please correctly connect power supply

3. We advise to install "Bluetooth master module"

4. The "State" is output foot for LED status, when bluetooth "Unconnected", output "Pulse" ; when bluetooth "connected", output "High level", we can determine the states from "MCU"

5. If only the board , No any "Bluetooth Function "

Package Included:

1Pcs X HC-05 bluetooth module with backboard