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i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
kr58.88

i5-2520M SR04A Stencil Template

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N12PLPA1 GT540M

N12P-LP-A1 GT540M

Part Number N12P-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000211
kr372.16

N12P-LP-A1 GT540M

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216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
kr58.88

216MSA4ALA12FG Stencil Template

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BD82B75 SLJ85 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000216
kr58.88

BD82B75 SLJ85 Stencil Template

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RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
kr37.61

RICHTEK RT8058GQW CB= (WQFN

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Hantek DSO5202P 200MHz 2 CH 1GSas 7 TFT LCD Digital Storage Oscilloscope

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Product description

Features:

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specification:

Sample Rate:Real-Time Sample: 1GS/s

Inputs Coupling:AC, DC, GND

Inputs Impendance:1MO2% ?20pF3pF

Probe Attenuation:1X, 10X

Supported Probe Attenuation Factor:1X, 10X, 100X, 1000X

Sample Rate Range:500MS/s--1GS/s

Waveform Interpolation:(sin x)/x

Record Length :40K

SEC/DIV Range:2ns/div to 40s/div

Sample Rate and Delay Time Accuracy:50ppm(at over any =1ms time interval)

Position Range:2ns/div to 10ns/div; (-4div x s/div) to 20ms

Vertical Resolution:8-bit resolution, all channel sampled simultaneously

Position Range:2mV/div to 10V/div

Bandwidth:200MHz

Rise Time at BNC( typical):1.8ns

Output Voltage( typical):About 5Vpp into =1MO load

Frequency(typical):1kHz

Supply Voltage:100-120VACRMS(10%), 45Hz to 440Hz, CAT?

120-240VACRMS(10%), 45Hz to 66Hz, CAT?

Power Consumption:<30W

Fuse:2A, T rating, 250V

Temperature Operating: 32? to 122? (0? to 50?)

Nonoperating: -40? to 159.8? (-40? to +71?) Cooling Method:Convection

Humidity:+104? or below (+40? or below): =90% relative humidity

106? to 122? (+41? to 50?): =60% relative humidity

Altitude Operating: Below 3,000m (10,000 feet)

Nonoperaring: Below 15,000m(50,000 feet)

Size Length:385mm, Width 200mm, Height 245mm

Weight:4.5KG(with Packing); 2.08KG(without Packing)

Packing list:

1.Digital storage Oscilloscope

2.Oscilloscope Probe Kit two sets

3.Oscilloscope powerline

4.Hantek data CD & Warranty Card customer return receipt & Manufacturer certificate

5.USB line

CH000218
kr3,863.06

Hantek DSO5202P 200MHz 2 CH 1GSa/s 7 TFT LCD Digital Storage Oscilloscope

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EM1200GBB22GV E11200

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000220
kr354.85

EM1200GBB22GV E1-1200

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AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
kr37.61

AO4304L

i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
kr58.88

i5-2520M SR04A Stencil Template

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N12PLPA1 GT540M

N12P-LP-A1 GT540M

Part Number N12P-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000211
kr372.16

N12P-LP-A1 GT540M

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216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
kr58.88

216MSA4ALA12FG Stencil Template

wishlist
Compare

BD82B75 SLJ85 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000216
kr58.88

BD82B75 SLJ85 Stencil Template

wishlist
Compare

RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
kr37.61

RICHTEK RT8058GQW CB= (WQFN

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Compare

Hantek DSO5202P 200MHz 2 CH 1GSas 7 TFT LCD Digital Storage Oscilloscope

Buy Probe Accessories: * PP-80 PP-150 PP-200 PP-150 T3100 Probe Accessories

Product description

Features:

Trigger mode: edge/pulse width/line selectable video/slop/overtime etc.

USB host and device connectivity, standard

Multiple automatic measurements

Four math functions, including FFTs standard

Provides software for PC real-time analysis

VGA Optional

Specification:

Sample Rate:Real-Time Sample: 1GS/s

Inputs Coupling:AC, DC, GND

Inputs Impendance:1MO2% ?20pF3pF

Probe Attenuation:1X, 10X

Supported Probe Attenuation Factor:1X, 10X, 100X, 1000X

Sample Rate Range:500MS/s--1GS/s

Waveform Interpolation:(sin x)/x

Record Length :40K

SEC/DIV Range:2ns/div to 40s/div

Sample Rate and Delay Time Accuracy:50ppm(at over any =1ms time interval)

Position Range:2ns/div to 10ns/div; (-4div x s/div) to 20ms

Vertical Resolution:8-bit resolution, all channel sampled simultaneously

Position Range:2mV/div to 10V/div

Bandwidth:200MHz

Rise Time at BNC( typical):1.8ns

Output Voltage( typical):About 5Vpp into =1MO load

Frequency(typical):1kHz

Supply Voltage:100-120VACRMS(10%), 45Hz to 440Hz, CAT?

120-240VACRMS(10%), 45Hz to 66Hz, CAT?

Power Consumption:<30W

Fuse:2A, T rating, 250V

Temperature Operating: 32? to 122? (0? to 50?)

Nonoperating: -40? to 159.8? (-40? to +71?) Cooling Method:Convection

Humidity:+104? or below (+40? or below): =90% relative humidity

106? to 122? (+41? to 50?): =60% relative humidity

Altitude Operating: Below 3,000m (10,000 feet)

Nonoperaring: Below 15,000m(50,000 feet)

Size Length:385mm, Width 200mm, Height 245mm

Weight:4.5KG(with Packing); 2.08KG(without Packing)

Packing list:

1.Digital storage Oscilloscope

2.Oscilloscope Probe Kit two sets

3.Oscilloscope powerline

4.Hantek data CD & Warranty Card customer return receipt & Manufacturer certificate

5.USB line

CH000218
kr3,863.06

Hantek DSO5202P 200MHz 2 CH 1GSa/s 7 TFT LCD Digital Storage Oscilloscope

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EM1200GBB22GV E11200

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000220
kr354.85

EM1200GBB22GV E1-1200

wishlist
Compare

AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
kr37.61

AO4304L

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Compare
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