Product Description

Input:AC 100-240V, 50-60Hz

Power:45W

Output:DC 19V 2.37A

Connector:4.0mm*1.35mm

Condition:100% New Compatible

Plug:US/EU Plug

Please make sure the DC output and tip size of ac adapter are accordant before you bid.

Click 'Ctrl+F' to find your model, if the Part No. of your original battery or machine model is not listed in our description, it may still fits your model as well, so please feel free to contact us to confirm the compatibility.)

Replace Part Number:

ADP-40TH A, EXA1206CH, 0A001-00330100, ADP-45AW A, ADP-33AW A, 90-XB34N OPW00000Y, N45W-01, N17908

NOTE: The same original P/N might be with different DC tips! The Right charger should be confirmed by your Laptop Model!

Fit Models:

Asus Vivobook F201E, Q200E, S200E, X201E, X202E.

Asus Zenbook UX21A, UX31A

Asus Taichi 21

Asus Q302 Q302L Q302LA Q302LA-BBI5T14 Q302LA-BHI3T09S Q302UA-BHI5T20

Asus X553M

Asus UX303UA

Asus Transformer Book Trio TX201LA

Asus Transformer Book T300 T300LA T300LA-Dh51T T300LA-XH71T

Asus Zenbook Prime UX305LA-AB51

Asus UX301 UX301LA

Note: DO NOT compatible with UX21E, UX31E

Package Content:

1 x Generic Power Adapter with US/EU Plug

216-0683013 HD3650

Part Number 216-0683013 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0926

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1 set DC Power 5.5*2.1mm Jack to 34 Plug Adapter Notebook Universal 66 Male Adapter Audio Connector

G86-630-A2 8400MGS

Part Number G86-630-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1246

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1 set DC Power 5.5*2.1mm Jack to 36 Plug Adapter Notebook Universal 66 Male Adapter Connector + Power cord clamp

N12P-NS1-S-A1

Part Number N12P-NS1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DH82HM87 SR13H

Part Number DH82HM87 SR13H Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N11P-GS1-A2 G330M

Part Number N11P-GS1-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR3JY i3-7130U

Part Number i3-7130U SR3JY Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-7130U SR3JY FJ8067702739765 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

AC82PM45 SLB97

Part Number AC82PM45 SLB97 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1013

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GM206-250-A1 GTX950

Part Number GM206-250-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock