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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: BGA Reballing Kits, Stencils
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Apple Macbook Pro Optical bay 2nd HDD Hard Drive Caddy SATA 95mm

Product Description

Universal For Apple Macbook Pro Optical bay 2nd HDD Hard Drive Caddy SATA 9.5mm

Specifications:

Condtion : brand new

Special desigh for Apple caddy

Height:9.5mm

Interface :sata to sata

Accept SSD Hard Drive

Compatible Model:

Compatible with any Apple product that has 9.5mm thick combo/Super Drive with SATA interface

Unibody MacBook/ MacBook Pro models

MacBook : MB466LL/A, MB467LL/A, MB881LL/A, MC240LL/A, MC207LL/A, MC516LL/A

MacBook Pro: MB470LL/A, MB471LL/A, MB604LL/A, MC026LL/A, MB990LL/A, MB991LL/A, MC118LL/A, MB985LL/A,

MB986LL/A, MC226LL/A, MC371LL/A, MC372LL/A, MC373LL/A, MC374LL/A, MC375LL/A, MC024LL/A,

MC700LL/A, MC721LL/A, MC723LL/A, MC724LL/A, MC725LL/A

The Module doesn't fit with PATA interface. (old optical drive interface IDE/PATA/ATAPI)

Package Includes:

1 x Caddy for apple laptop

4 x Srews

CH002177
€7.34

Apple Macbook Pro Optical bay 2nd HDD Hard Drive Caddy SATA 9.5mm

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MCP79MXTB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
€5.40

MCP79MXT-B3 Stencil Template

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i7620M Q4CB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000425
€5.40

i7-620M Q4CB Stencil Template

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USB 30 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 AirPro

SSD Enclosure for 2013 to 2017 MacBook Air Pro Retina,USB 3.0 SSD Adapter with case

Description :

This product is 2013-2014-2015 MACBOOK AIR/PRO Retina ssd SSD to USB adapter, it is allowed to use SSD from 2013 2014 2015 2016 2017 Macbook SSD module through USB3.0 port on your desktop or laptop.

Features :

? Fit SSD modules only from the following Apple 2013 MACBOOK AIr PRO:

11" Air Mid 2013, A1465(MD711.MD712)

13" Air Mid 2013, A1466 (MD760.MD761)

13" PRO Retina Late 2013, A1502 (ME864, ME865, ME866)

15" PRO Retina Late 2013, A1398 (ME293, ME294, ME874)

? Fit following SSD modules:

Samsung MZ-JPU128T/0A2, MZ-JPU256T/0A2,MZ-JPU512T/0A2,MZ-KPU1T0T/0A2 Sandisk SD6PQ4M-128G

? Support Hi-Speed USB 3.0(5Gbps), PCIe Gen2 5Gb/s mass storage interface

? Extra power needed if USB3.0 port can't provide enough power supply

Note :

1. Support Sandisk SD6PQ4M-128G, SD6PQ4M-256G SSD; Support Samsung MZ-JPU128T, MZ-JPU256T, MZ-JPU512T, MZ-KPU1TOT, MZ-JPV1280.

2. DO NOT support Toshiba THNSN2128GSPS, Samsung MZ-JPV2560/5120, MZ-KPV1TOT

3. Before you buy this item,pls check if your SSD is 2013-2016 version with 12+16pin gold-pins.

Package included :

? 1x USB 3.0 to 2013 2014 2015 2016 2017 SSD Adapter Case Enclosure

? 1x USB 3.0 to mini usb cable

? 1x screwdriver

CH002232
€63.28

USB 3.0 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 Air/Pro

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Apple BIOS IMac 215 2011 A1311 EMC2428

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002233
€30.71

Apple BIOS IMac 21.5 2011 A1311 EMC2428

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SRG0S SRG0N SRGKK SRFD0 SRGKG SRGKF Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000427
€18.40

SRG0S SRG0N SRGKK SRFD0 SRGKG SRGKF Stencil Template

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2160811000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000428
€5.40

216-0811000 Stencil Template

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Compare
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Apple BIOS MBA13 2015 A1466 82000165 EMC2925

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002244
€32.08

Apple BIOS MBA13 2015 A1466 820-00165 EMC2925

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G96632C1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000432
€5.40

G96-632-C1 Stencil Template

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i72617M SR03T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000433
€5.40

i7-2617M SR03T Stencil Template

Apple Macbook Pro Optical bay 2nd HDD Hard Drive Caddy SATA 95mm

Product Description

Universal For Apple Macbook Pro Optical bay 2nd HDD Hard Drive Caddy SATA 9.5mm

Specifications:

Condtion : brand new

Special desigh for Apple caddy

Height:9.5mm

Interface :sata to sata

Accept SSD Hard Drive

Compatible Model:

Compatible with any Apple product that has 9.5mm thick combo/Super Drive with SATA interface

Unibody MacBook/ MacBook Pro models

MacBook : MB466LL/A, MB467LL/A, MB881LL/A, MC240LL/A, MC207LL/A, MC516LL/A

MacBook Pro: MB470LL/A, MB471LL/A, MB604LL/A, MC026LL/A, MB990LL/A, MB991LL/A, MC118LL/A, MB985LL/A,

MB986LL/A, MC226LL/A, MC371LL/A, MC372LL/A, MC373LL/A, MC374LL/A, MC375LL/A, MC024LL/A,

MC700LL/A, MC721LL/A, MC723LL/A, MC724LL/A, MC725LL/A

The Module doesn't fit with PATA interface. (old optical drive interface IDE/PATA/ATAPI)

Package Includes:

1 x Caddy for apple laptop

4 x Srews

CH002177
€7.34

Apple Macbook Pro Optical bay 2nd HDD Hard Drive Caddy SATA 9.5mm

wishlist
Compare

MCP79MXTB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
€5.40

MCP79MXT-B3 Stencil Template

wishlist
Compare

i7620M Q4CB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000425
€5.40

i7-620M Q4CB Stencil Template

wishlist
Compare

USB 30 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 AirPro

SSD Enclosure for 2013 to 2017 MacBook Air Pro Retina,USB 3.0 SSD Adapter with case

Description :

This product is 2013-2014-2015 MACBOOK AIR/PRO Retina ssd SSD to USB adapter, it is allowed to use SSD from 2013 2014 2015 2016 2017 Macbook SSD module through USB3.0 port on your desktop or laptop.

Features :

? Fit SSD modules only from the following Apple 2013 MACBOOK AIr PRO:

11" Air Mid 2013, A1465(MD711.MD712)

13" Air Mid 2013, A1466 (MD760.MD761)

13" PRO Retina Late 2013, A1502 (ME864, ME865, ME866)

15" PRO Retina Late 2013, A1398 (ME293, ME294, ME874)

? Fit following SSD modules:

Samsung MZ-JPU128T/0A2, MZ-JPU256T/0A2,MZ-JPU512T/0A2,MZ-KPU1T0T/0A2 Sandisk SD6PQ4M-128G

? Support Hi-Speed USB 3.0(5Gbps), PCIe Gen2 5Gb/s mass storage interface

? Extra power needed if USB3.0 port can't provide enough power supply

Note :

1. Support Sandisk SD6PQ4M-128G, SD6PQ4M-256G SSD; Support Samsung MZ-JPU128T, MZ-JPU256T, MZ-JPU512T, MZ-KPU1TOT, MZ-JPV1280.

2. DO NOT support Toshiba THNSN2128GSPS, Samsung MZ-JPV2560/5120, MZ-KPV1TOT

3. Before you buy this item,pls check if your SSD is 2013-2016 version with 12+16pin gold-pins.

Package included :

? 1x USB 3.0 to 2013 2014 2015 2016 2017 SSD Adapter Case Enclosure

? 1x USB 3.0 to mini usb cable

? 1x screwdriver

CH002232
€63.28

USB 3.0 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 Air/Pro

wishlist
Compare

Apple BIOS IMac 215 2011 A1311 EMC2428

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002233
€30.71

Apple BIOS IMac 21.5 2011 A1311 EMC2428

wishlist
Compare

SRG0S SRG0N SRGKK SRFD0 SRGKG SRGKF Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000427
€18.40

SRG0S SRG0N SRGKK SRFD0 SRGKG SRGKF Stencil Template

wishlist
Compare

2160811000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000428
€5.40

216-0811000 Stencil Template

wishlist
Compare

Apple BIOS MBA13 2015 A1466 82000165 EMC2925

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002244
€32.08

Apple BIOS MBA13 2015 A1466 820-00165 EMC2925

wishlist
Compare

G96632C1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000432
€5.40

G96-632-C1 Stencil Template

wishlist
Compare

i72617M SR03T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000433
€5.40

i7-2617M SR03T Stencil Template

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Compare
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