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G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

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iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

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New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

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G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

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Apple BIOS MBP13 2015 A1502 8204924 EMC2835

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001950
€32.08

Apple BIOS MBP13 2015 A1502 820-4924 EMC2835

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BD82Q67 SLJ4D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000398
€5.40

BD82Q67 SLJ4D Stencil Template

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W209 Pro Battery TesterCharger Activation Board For Apple iPhone 411ProMax Android

The battery test/charge/activation board brings old or dead Apple iPhone batteries back to life.

Advanced design allows you to charge a maximum of two batteries at any one time.

2A Current Protection/cut off if the current of voltage are too high the protection automatically disconnects the power supply.

Short circuit protection: If the battery has a short-circuit, the warning lamp will illuminate - Do not to charge the battery!

Visual display - A dual LCD display showing current & voltage.

Safe and easy to use - Attach battery and power to use, when the battery is full it will stop the output charge current to prevent overcharging.

Low voltage activation: os battery voltage is below 3V, the battery can be re-activated using the activation button.

CH002041
€16.04

W209 Pro Battery Tester/Charger Activation Board For Apple iPhone 4-11ProMax Android

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QDNVS110MTNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000408
€5.40

QD-NVS110MT-N-A3 Stencil Template

G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

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iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

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Compare

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

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Compare

G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

wishlist
Compare

Apple BIOS MBP13 2015 A1502 8204924 EMC2835

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001950
€32.08

Apple BIOS MBP13 2015 A1502 820-4924 EMC2835

wishlist
Compare

BD82Q67 SLJ4D Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000398
€5.40

BD82Q67 SLJ4D Stencil Template

wishlist
Compare

W209 Pro Battery TesterCharger Activation Board For Apple iPhone 411ProMax Android

The battery test/charge/activation board brings old or dead Apple iPhone batteries back to life.

Advanced design allows you to charge a maximum of two batteries at any one time.

2A Current Protection/cut off if the current of voltage are too high the protection automatically disconnects the power supply.

Short circuit protection: If the battery has a short-circuit, the warning lamp will illuminate - Do not to charge the battery!

Visual display - A dual LCD display showing current & voltage.

Safe and easy to use - Attach battery and power to use, when the battery is full it will stop the output charge current to prevent overcharging.

Low voltage activation: os battery voltage is below 3V, the battery can be re-activated using the activation button.

CH002041
€16.04

W209 Pro Battery Tester/Charger Activation Board For Apple iPhone 4-11ProMax Android

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Compare

QDNVS110MTNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000408
€5.40

QD-NVS110MT-N-A3 Stencil Template

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Compare
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