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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Bios Chip Programming
  • Categories: Programmer & Sockets
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TSOP5605TPO1NT TSOP56DIP56 Adapter

Burn seat pressure shrapnel HMILU TSOP56

Product profile:

Product use: seat, seat aging test, the IC chip of the TSOP56 test, burn

Suitable for packaging: TSOP56 pin spacing 0.5mm

Test block: TSOP56 burning seat

Description:

Model: TSOP56TSOP56-DIP56

Pin spacing (mm):0.5mm

Feet: 56

Chip size: 14mm*18mm

CH000710
€24.00

TSOP56-0.5-TPO1NT TSOP56-DIP56 Adapter

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC408LLA

PO000010
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC408LL/A

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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

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Apple BIOS MBP12 2017 A1534 82000687 EMC2998

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001550
€44.38

Apple BIOS MBP12 2017 A1534 820-00687 EMC2998

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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

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Apple BIOS MBP13 2016 A1708 82000875 EMC2978

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001569
€37.05

Apple BIOS MBP13 2016 A1708 820-00875 EMC2978

  • -20%
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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

TSOP5605TPO1NT TSOP56DIP56 Adapter

Burn seat pressure shrapnel HMILU TSOP56

Product profile:

Product use: seat, seat aging test, the IC chip of the TSOP56 test, burn

Suitable for packaging: TSOP56 pin spacing 0.5mm

Test block: TSOP56 burning seat

Description:

Model: TSOP56TSOP56-DIP56

Pin spacing (mm):0.5mm

Feet: 56

Chip size: 14mm*18mm

CH000710
€24.00

TSOP56-0.5-TPO1NT TSOP56-DIP56 Adapter

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  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC408LLA

PO000010
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC408LL/A

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  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

wishlist
Compare

Apple BIOS MBP12 2017 A1534 82000687 EMC2998

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001550
€44.38

Apple BIOS MBP12 2017 A1534 820-00687 EMC2998

wishlist
Compare
  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

wishlist
Compare

Apple BIOS MBP13 2016 A1708 82000875 EMC2978

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001569
€37.05

Apple BIOS MBP13 2016 A1708 820-00875 EMC2978

wishlist
Compare
  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

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Compare
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