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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer Spare Part
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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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N14EGTXWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000410
€7.46

N14E-GTX-W-A2 Stencil Template

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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2160811030 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000413
€9.97

216-0811030 Stencil Template 90*90

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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M5Y71 SR23Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
€7.46

M-5Y71 SR23Q Stencil Template

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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H99261 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
€14.92

H99261 Stencil Template 90*90

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i7 I77Y75 BTOCTO

PO000035
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i7 I7-7Y75 BTO/CTO

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MCP79MXTB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
€5.40

MCP79MXT-B3 Stencil Template

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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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N14EGTXWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000410
€7.46

N14E-GTX-W-A2 Stencil Template

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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2160811030 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000413
€9.97

216-0811030 Stencil Template 90*90

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Compare
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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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M5Y71 SR23Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
€7.46

M-5Y71 SR23Q Stencil Template

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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H99261 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
€14.92

H99261 Stencil Template 90*90

wishlist
Compare
  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i7 I77Y75 BTOCTO

PO000035
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i7 I7-7Y75 BTO/CTO

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MCP79MXTB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
€5.40

MCP79MXT-B3 Stencil Template

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Compare
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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

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