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GF7300GSNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000335
€5.40

GF-7300GS-N-A3 Stencil Template

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Orange5 Professional Programming Device With Full Packet Hardware

Orange5 Professional Programming Device With Basic Module Get Four Additional Software Free

Login to Download: * Configure

List of Special Functions

Chip Support List

Software Version: V1.34, Software Does not Support Update.

Language: English and Russian

Systems: XP WIN7 WIN8

Additional Supported Software:

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Software Licenses:

MTRK (Included in Orange-5 base)

TMS (Included in Orange-5 base)

M08V NEW

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Orange5 Technical Info:

* USB power supply (USB2.0/3.0)

* Universal easy to plug panel ZIF16 for EEPROM

* Control of contacts in the sockets

* Two expansions compatible with Orange4 and Omega MTRK

* Protection against overcurrent

* Overload voltage protection

* Two types of power supply: Standart (USB) and enhanced (USB + external power supply)

* Three 3 adjustable voltage and current control: Voltage of power supply ( 2.0...5.0V ), programming voltage (2.0...21.0V), additional static 10V for microcontrollers

* High-speed bidirectional pin drivers with adjustable voltage (2.0...5.0V)

* Wave cycle generator with frequency ( up to 24 Mhz) and out voltage(2.0...5.0V) adjustment

* Capability of functional emulation of class CDC USB devices

* Built-in 32-bit virtual machine

* Supported interface: I2C, SPI, MicroWire, JTAG, UART, BDM, ISO7816, K-LINE (via adapter), CAN (via adapter)

* Programmer is encolsed in a functional box. Supported working under Windows XP/7 32bit. [*Win8.1]

- Installation and Work with Orange-5 under Windwos 7 and Windows 8.1

CnCterm - Terminal program for work with COM ports.

Feature:

Supports any COM ports, incuding virtual ones from 1 to 20

Works with text (ASCII) and HEX mode

Creating a list of commands that allows editing and fast sending

Fine-tuning the exchange rate

Saving files including command and port settings.

Saving incoming data in binary files

File transfer via serial port.

Delay settings for bytes and blocks

"Echo" mode

Delay settings between incoming data

Managment of DTR, RTS chains, visualising DSR, CTS, CD, RI

Program doesn't need to be installed

Supports Orange5 programmer in emulation mode.

CH000806
€108.16

Orange5 Professional Programming Device With Full Packet Hardware

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N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

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GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
€6.47

GK106-220-A1 Stencil Template

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iphone7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000363
€5.72

iphone7 Stencil Template

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Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
€8.58

Samsung Exynos9810/S9/S9+ Stencil Template

GF7300GSNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000335
€5.40

GF-7300GS-N-A3 Stencil Template

wishlist
Compare

Orange5 Professional Programming Device With Full Packet Hardware

Orange5 Professional Programming Device With Basic Module Get Four Additional Software Free

Login to Download: * Configure

List of Special Functions

Chip Support List

Software Version: V1.34, Software Does not Support Update.

Language: English and Russian

Systems: XP WIN7 WIN8

Additional Supported Software:

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Software Licenses:

MTRK (Included in Orange-5 base)

TMS (Included in Orange-5 base)

M08V NEW

Immo HPX 9V0

NEC V850ES/SJ3 V850ES/SG3 UART

NEC V850E2 NEW

Orange5 Technical Info:

* USB power supply (USB2.0/3.0)

* Universal easy to plug panel ZIF16 for EEPROM

* Control of contacts in the sockets

* Two expansions compatible with Orange4 and Omega MTRK

* Protection against overcurrent

* Overload voltage protection

* Two types of power supply: Standart (USB) and enhanced (USB + external power supply)

* Three 3 adjustable voltage and current control: Voltage of power supply ( 2.0...5.0V ), programming voltage (2.0...21.0V), additional static 10V for microcontrollers

* High-speed bidirectional pin drivers with adjustable voltage (2.0...5.0V)

* Wave cycle generator with frequency ( up to 24 Mhz) and out voltage(2.0...5.0V) adjustment

* Capability of functional emulation of class CDC USB devices

* Built-in 32-bit virtual machine

* Supported interface: I2C, SPI, MicroWire, JTAG, UART, BDM, ISO7816, K-LINE (via adapter), CAN (via adapter)

* Programmer is encolsed in a functional box. Supported working under Windows XP/7 32bit. [*Win8.1]

- Installation and Work with Orange-5 under Windwos 7 and Windows 8.1

CnCterm - Terminal program for work with COM ports.

Feature:

Supports any COM ports, incuding virtual ones from 1 to 20

Works with text (ASCII) and HEX mode

Creating a list of commands that allows editing and fast sending

Fine-tuning the exchange rate

Saving files including command and port settings.

Saving incoming data in binary files

File transfer via serial port.

Delay settings for bytes and blocks

"Echo" mode

Delay settings between incoming data

Managment of DTR, RTS chains, visualising DSR, CTS, CD, RI

Program doesn't need to be installed

Supports Orange5 programmer in emulation mode.

CH000806
€108.16

Orange5 Professional Programming Device With Full Packet Hardware

wishlist
Compare

N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

wishlist
Compare

GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
€6.47

GK106-220-A1 Stencil Template

wishlist
Compare

iphone7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000363
€5.72

iphone7 Stencil Template

wishlist
Compare

Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
€8.58

Samsung Exynos9810/S9/S9+ Stencil Template

wishlist
Compare
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