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ATHEROS AR8121AL1E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001412
€3.45

ATHEROS AR8121-AL1E

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Intersil ISL9502

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001413
€3.45

Intersil ISL9502

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TI BQ20842

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001414
€3.97

TI BQ20842

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MAX77693

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001415
€4.77

MAX77693

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V54 FGTech Galletto 4 Master BDMOBD Function Unlock Version ECU Programmer

Description:

Top 6 Reasons To Get FGTech Galletto 4

1. Latest Version: V54

2. Supported Operating System: windows XP. more friendly than Fgtech v53 , much easier to operate

3. Unlock Version: Can Use Directly. No Need To Activate

4. FGTECH V54 PCB board

5. Supported Language: English, Italian, German, French, Spanish, Portuguese, Czech, Turkish

6. Support Tricore Function

FG Tech Galletto 4-Master V54 BDM-OBD is a famous chip tuning tool for all cars, trucks, motorcycles, Marine, BDM MPCxx, BDM Boot Mode , checksum. This item cannot only work as FGTech Galletto 4-Master, but can also work for BDM-OBD.

FGTech Galletto 4-Master this new system developed with high-speed USB2 technology is the fastest and most secure product on the market, it is easy to install and use by anyone. Our system comes furnished complete with all Car, Truck, Motorbyke, Marine, BDM MPCxx , BDM Boot Mode, checksum.

Boot Mode System:

Infineon Sak TC1766

Infineon Sak TC1767

Infineon Sak TC1792

Infineon Sak TC1796

Infineon Sak TC1797

NEW JTAG - BDM - MOTOROLA - FREESCALE - INFINEON

Freescale MPC 5553/5554/5565/5566 NEXSUS PORT New IAW MJD 8F2 - Mair 8GMF

New Delphy DCM3.5xx DCM3.7xx TRW

Motorola Freescale MPC 555/556/561/562/563/564/565

Motorola MC 68332 - MC YQQCU - MC 68377 Trionic 5/7/8 GM-OPEL-SAAB

Motorola MC 68376 Campi 01 Lamborghini - Lotus

Motorola MC 68336 MEMS D5 ROVER

Motorola ZC 439615 - ZC 439507 IAW FIAT - VAG

New Line OBD protocols VPM GM - Hummer-Corvette-Munstang-Blazer-Cadilac

New Line OBD protocols Tx-Rx - Subaru - Mitsubischi - Hitachi - Denso ecu

All EDC17 MED17 is good always modify with Boot Mode .

Automatic Checksum:

All old protocols included from Bosch MExx / EDCxx / Marelli / Siemens / Delpy / Lucas / Denso

Boot Mode C167x / ST10, Boot Mode Infineon With password Bosch , Siemens

Motorola MC68332 - MCYQQCU - MC68377 , MC68376 , MC68336, ZC439615 ,ZC439507

Motorola Freescale MPC 555/556/561/562/563/564/565

Freescale MPC 5553/5554/5565/5566

BDM .

5-30V Car / Industrial Vehicles, L line / K line KWP, CAN

Can Bus V2.0 50Kb > 1000Kb

J1850 VPW PWM GM -FORD

Rx Tx RS232,

RS 485,

Automatic setup Pull up K-L line 250, 500, 1000 ohm,

Automatic setup termination Can bus 0, 60,120 ohm,

Master Version:

Recovery Mode Completa

Funzione scan tool per eliminare i DTC

Function scan tool for erase the DTC

Controllo tensione di batteria auto in tempo reale

Check tension of battery car in real time

Package including:

1pc x New version main interface

1pc x ECU cable for boot

1pc x Adapter for BDM to CMD with bdm cables

3pcs x BDM adapters

6pcs x BDM connectors

2pcs x Power cable

1pc x OBD2 cable

1pc x USB cable (1.5meter)

1pc x CD (2012 version SW -MASTER, documents pdf, pictures, etc.)

CH001416
€85.00

V54 FGTech Galletto 4 Master BDM-OBD Function Unlock Version ECU Programmer

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2160774207 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001417
€5.40

216-0774207 Stencil Template

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EMC EMB20N03V

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001420
€3.45

EMC EMB20N03V

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GFGO7300TNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001421
€5.40

GF-GO7300T-N-A3 Stencil Template

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Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

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Pentium DualCore Mobile SR0FB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001423
€5.40

Pentium Dual-Core Mobile SR0FB Stencil Template

ATHEROS AR8121AL1E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001412
€3.45

ATHEROS AR8121-AL1E

wishlist
Compare

Intersil ISL9502

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001413
€3.45

Intersil ISL9502

wishlist
Compare

TI BQ20842

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001414
€3.97

TI BQ20842

wishlist
Compare

MAX77693

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001415
€4.77

MAX77693

wishlist
Compare

V54 FGTech Galletto 4 Master BDMOBD Function Unlock Version ECU Programmer

Description:

Top 6 Reasons To Get FGTech Galletto 4

1. Latest Version: V54

2. Supported Operating System: windows XP. more friendly than Fgtech v53 , much easier to operate

3. Unlock Version: Can Use Directly. No Need To Activate

4. FGTECH V54 PCB board

5. Supported Language: English, Italian, German, French, Spanish, Portuguese, Czech, Turkish

6. Support Tricore Function

FG Tech Galletto 4-Master V54 BDM-OBD is a famous chip tuning tool for all cars, trucks, motorcycles, Marine, BDM MPCxx, BDM Boot Mode , checksum. This item cannot only work as FGTech Galletto 4-Master, but can also work for BDM-OBD.

FGTech Galletto 4-Master this new system developed with high-speed USB2 technology is the fastest and most secure product on the market, it is easy to install and use by anyone. Our system comes furnished complete with all Car, Truck, Motorbyke, Marine, BDM MPCxx , BDM Boot Mode, checksum.

Boot Mode System:

Infineon Sak TC1766

Infineon Sak TC1767

Infineon Sak TC1792

Infineon Sak TC1796

Infineon Sak TC1797

NEW JTAG - BDM - MOTOROLA - FREESCALE - INFINEON

Freescale MPC 5553/5554/5565/5566 NEXSUS PORT New IAW MJD 8F2 - Mair 8GMF

New Delphy DCM3.5xx DCM3.7xx TRW

Motorola Freescale MPC 555/556/561/562/563/564/565

Motorola MC 68332 - MC YQQCU - MC 68377 Trionic 5/7/8 GM-OPEL-SAAB

Motorola MC 68376 Campi 01 Lamborghini - Lotus

Motorola MC 68336 MEMS D5 ROVER

Motorola ZC 439615 - ZC 439507 IAW FIAT - VAG

New Line OBD protocols VPM GM - Hummer-Corvette-Munstang-Blazer-Cadilac

New Line OBD protocols Tx-Rx - Subaru - Mitsubischi - Hitachi - Denso ecu

All EDC17 MED17 is good always modify with Boot Mode .

Automatic Checksum:

All old protocols included from Bosch MExx / EDCxx / Marelli / Siemens / Delpy / Lucas / Denso

Boot Mode C167x / ST10, Boot Mode Infineon With password Bosch , Siemens

Motorola MC68332 - MCYQQCU - MC68377 , MC68376 , MC68336, ZC439615 ,ZC439507

Motorola Freescale MPC 555/556/561/562/563/564/565

Freescale MPC 5553/5554/5565/5566

BDM .

5-30V Car / Industrial Vehicles, L line / K line KWP, CAN

Can Bus V2.0 50Kb > 1000Kb

J1850 VPW PWM GM -FORD

Rx Tx RS232,

RS 485,

Automatic setup Pull up K-L line 250, 500, 1000 ohm,

Automatic setup termination Can bus 0, 60,120 ohm,

Master Version:

Recovery Mode Completa

Funzione scan tool per eliminare i DTC

Function scan tool for erase the DTC

Controllo tensione di batteria auto in tempo reale

Check tension of battery car in real time

Package including:

1pc x New version main interface

1pc x ECU cable for boot

1pc x Adapter for BDM to CMD with bdm cables

3pcs x BDM adapters

6pcs x BDM connectors

2pcs x Power cable

1pc x OBD2 cable

1pc x USB cable (1.5meter)

1pc x CD (2012 version SW -MASTER, documents pdf, pictures, etc.)

CH001416
€85.00

V54 FGTech Galletto 4 Master BDM-OBD Function Unlock Version ECU Programmer

wishlist
Compare

2160774207 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001417
€5.40

216-0774207 Stencil Template

wishlist
Compare

EMC EMB20N03V

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001420
€3.45

EMC EMB20N03V

wishlist
Compare

GFGO7300TNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001421
€5.40

GF-GO7300T-N-A3 Stencil Template

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Compare

Laptop Motherboard Socket 754M Base BGA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001422
€4.85

Laptop Motherboard Socket 754M Base BGA

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Compare

Pentium DualCore Mobile SR0FB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001423
€5.40

Pentium Dual-Core Mobile SR0FB Stencil Template

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Compare
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