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Maxim MAX8797G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001424
€3.45

Maxim MAX8797G

GFGO7600HNB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001425
€5.40

GF-GO7600-H-N-B1 Stencil Template

EZP2019 USB Programmer Support 24252693 EEPROM Flash Bios win8 3264bit

Login to Download: Download software Device List

Field of application:

This programmer can read and write the bios chips of DVD,TV,PC,harddisk,etc.

Features:

1. USB 2.0 interface, the speed is 12Mbps.

2. The speed of reading and writing is fast.

3. Auto detect chip modles.

4. Auto select power votage.

5. Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

6. Small shape.

7. Windows XP, Windows Vista, Win7,WIN8,WIN10.

List:

1. Programmer 1

2. Usb cable 1

3. CD 1

4. Manual(a file on CD) 1

5. Simple socket for SMD chips 2

CH001426
€8.58

EZP2019+ USB Programmer Support 24/25/26/93 EEPROM Flash Bios win8 32/64bit

Maxim MAX1992E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001427
€3.45

Maxim MAX1992E

25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

Maxim MAX8760

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001429
€3.45

Maxim MAX8760

BROADCOM BCM5906MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001430
€3.45

BROADCOM BCM5906MKMLG

GFGO6600NA4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001431
€5.40

GF-GO6600-N-A4 Stencil Template

2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

CXD90026G SONY PS4 CPU Processor

CXD90026G SONY PS4 CPU Processor

Part Number CXD90026G Manufacturer SONY

BGA Alloy No Pb/Lead Free Date Code 1026

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001433
€42.10

CXD90026G SONY PS4 CPU Processor

TL866II PLUS Programmer EEPROM Support NAND Flash AVR MCU GAL PIC SPI 25 Universal Adapter Extractor Clip

TL866II PLUS Programmer can use for items list:

Login to Download: Download software Device Support List instruction manual

Programmer Overview

1.1 Performance Introduction

Carefully built low-cost professional programmer, high-density chip production process, a

unified user interface, easy to use, functional integrity, application software, reliable

operation, code small, faster execution. supported operating system:

WINXP WIN2003 WIN2008 VISTA WIN7 WIN8 WIN10 32-bit or 64-bit operating system

? The programming speed is greatly improved. It is suitable for small batch production and supports 4 programmers for one computer.

? A wide range of chip support, the initial version supports the chip 15000+, supports a variety of 24 25 26 27 28 29 37 39 49 50 series of serial and parallel memory chips, microcontroller 51 series, ATMEL AVR ATMEGA AT90 series, MICROCHIP PIC10 PIC12 PIC16 PIC18 series microcontroller , GAL programmable logic device programming, SRAM test, 54/74 and CMOS4000 integrated circuit integrated functional test.

Support NAND Flash chip, the function is complete and comprehensive, the capacity supports to 8Gbits.

25 series Nor Flash capacity support to 512Mbits.

? Pin contact check function, poor contact pin can pinpoint

? Ultra-low power consumption: the entire programmer uses ultra-low-power chips, using USB interface, the first truly all chip programming

without external power integrated programmer. Portable performance super: the world's smallest volume, size 10CM * 6CM * 2.5CM, only the size of the driver's license.

? Programmable VCC from 1.8V to 6.5V, VPP from 1.8V to 18V chip

? Chip serial number secondary development functions: Programmer built a variety of commonly used automatic numbering function. And can use a custom algorithm to achieve any sequence number through DLL dynamic library. This feature allows you to produce

a unique identification info rmation for each chip in mass production. The logo can also be encrypted with a custom algorithm to more effectively protect your product's rights.

? Universal serial programming interface ICSP (to support both high-voltage parallel programming and low-volt age serial programming). Note: ICSP now supports 24-Series 25 Series 93 Series Serial Integrated Circuits, ATMEL89S51,52, AVR ATMEGAxxx Full

Series, and MICROCHIP PIC10Fxxx 12Fxxx 16Fxxx 18Fxxx Full Series, and the new series of SYNCMOS SM59Dxx SM59Rxx fu ll range chips for in-circuit serial programming.

? Powerful 54 / 74F / LS / HC CMOS4000 Series Integrated Functionality Tests: The First Development Programmer to Test Common Logic ICs True, Test Errors Locating Logic Gate Circuits, Test Arbitrary Possible input combinations.

1.2 Programmer chip support range

? Variety of 26 27 28 29 37 39 49 50 series of parallel ROM, EPROM, EEPROM

Fast, full support. Support TSOP32 TSOP40 TSOP48 chips to 64MBits, will join the TSOP56 pin support.

(TL866II programming voltage VPP only supports up to 18V, for early 27C series ROM, the

chip with 21V 25V VPP voltage no longer supports writing, but can be read. If it is used,

the VPP with the same type of programming voltage can be used as 13V or 12V chip replacement, for example: 27C32 21V or 13V Vpp chip,Pay attention to the VPP voltage)

? 24 25 35 45 85 93 95 Series Serial EEPROM

Serial Series Chip Support Full, Supports Chip Capacity 25 Series 8 or 16PIN to 512MBits (64M Bytes)

? NAND FLASH chip supports up to 8Gbits

? MCU series, hundreds of models of 51 series of microcomputer

? AVR microcontroller package scratch ATMEGA series ATtiny series AT90XXX series of microcontrollers, all AVR ATMEGAxxx chip also supports the ICSP interface for SPI serial download programming. Support AVR one-to-one soft-key with RC correction byte.

? MICROCHIP PIC10 PIC12 PIC16 PIC18 Series Microcontroller:

PIC series of more than 300 models, more than 900 package chip support, currently supports

one of the most complete PIC chip integrated programmer. For vario

us types of PIC monolithic, in strict accordance with the manufacturer's manual requirements, the optimal programming, programming speed is excellent. The vast majority of chips support both ISCP online programming and programming through programming sockets.

? GAL programmable logic device programming

? SRAM test

Support for common 24 61 62 DS12 series SRAM test, respectively, to data line testing,

address line testing, memory unit incremental testing and unit testing.

? Super performance 54 / 74F / LS / HC CMO

S4000 series integrated circuit integrated

Function test:

The first development-type programmer to really test common logic ICs to test for errors

that can be located to logic gates, and to test any possible combinations of inputs in an integrated circuit when testing.

Package In clude:

a. TL866CS programador con el paquete 1 pcs

b. Connect the USB cable 1 pcs

c. Softerware CD 1 pcs

24 Universal Adapter Package Contents

1. 1.8 V Adpater 1 pcs

2. TSSOP28 Adpater 1 pcs

3. TSOP32/40/48-DIP40 NAND Socket 0.5mm Adapter

4. SOIC8 SOP8 IC Flash clip 1 pcs

5. SOP44/PSOP44 Adpater 1 pcs

6. TSOP32/40/48 placa base 1 pcs

7. SOP56-DIP48 adpater 1 pcs

8. TSOP32/40/48 tablero superior de soldadura 1 pcs

9. TSOP48 adaptador 2in 1 base 1 pcs

10. TSOP40 (A) Bit placa Base 1 pcs

11. TSOP40 (B) 16bit placa base 1 pcs

12. TSOP32/40/48 tablero superior de soldadura 1 pcs

13. Adaptador 300mil SOP28-DIP28 1 pcs

14. SOP20-DIP20 Adaptador 200-208mil 1 pcs

15. SOP8-DIP8 200-208mil adpater 1 pcs

16. Adaptador 150mil SOP16-DIP16 1 pcs

17. Adaptador 150mil SOP8-DIP8 1 pcs

18. Adaptador PLCC44-DIP40 1 pcs

19. PLCC32-DIP32 1 pcs

20. Adaptador PLCC28-DIP24 1 pcs

21. Adaptador PLCC20-DIP20 1 pcs

22. SOP16/SOP14/SOP8-DIP8 adpater

23. SOP8/MSOP8/SSOP8/SOP16-DIP16 simple adaptador 1 pcs

24. Adaptador SOP8-DIP8 simples 1 pcs

25. PLCC IC Extractor 1 pcs

CH001434
€117.98

TL866II PLUS Programmer EEPROM Support NAND Flash AVR MCU GAL PIC SPI 25 Universal Adapter Extractor Clip

Intersil ISL6263CRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001435
€3.45

Intersil ISL6263CRZ

Maxim MAX8797G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001424
€3.45

Maxim MAX8797G

GFGO7600HNB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001425
€5.40

GF-GO7600-H-N-B1 Stencil Template

EZP2019 USB Programmer Support 24252693 EEPROM Flash Bios win8 3264bit

Login to Download: Download software Device List

Field of application:

This programmer can read and write the bios chips of DVD,TV,PC,harddisk,etc.

Features:

1. USB 2.0 interface, the speed is 12Mbps.

2. The speed of reading and writing is fast.

3. Auto detect chip modles.

4. Auto select power votage.

5. Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

6. Small shape.

7. Windows XP, Windows Vista, Win7,WIN8,WIN10.

List:

1. Programmer 1

2. Usb cable 1

3. CD 1

4. Manual(a file on CD) 1

5. Simple socket for SMD chips 2

CH001426
€8.58

EZP2019+ USB Programmer Support 24/25/26/93 EEPROM Flash Bios win8 32/64bit

Maxim MAX1992E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001427
€3.45

Maxim MAX1992E

25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

Maxim MAX8760

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001429
€3.45

Maxim MAX8760

BROADCOM BCM5906MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001430
€3.45

BROADCOM BCM5906MKMLG

GFGO6600NA4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001431
€5.40

GF-GO6600-N-A4 Stencil Template

2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

CXD90026G SONY PS4 CPU Processor

CXD90026G SONY PS4 CPU Processor

Part Number CXD90026G Manufacturer SONY

BGA Alloy No Pb/Lead Free Date Code 1026

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001433
€42.10

CXD90026G SONY PS4 CPU Processor

TL866II PLUS Programmer EEPROM Support NAND Flash AVR MCU GAL PIC SPI 25 Universal Adapter Extractor Clip

TL866II PLUS Programmer can use for items list:

Login to Download: Download software Device Support List instruction manual

Programmer Overview

1.1 Performance Introduction

Carefully built low-cost professional programmer, high-density chip production process, a

unified user interface, easy to use, functional integrity, application software, reliable

operation, code small, faster execution. supported operating system:

WINXP WIN2003 WIN2008 VISTA WIN7 WIN8 WIN10 32-bit or 64-bit operating system

? The programming speed is greatly improved. It is suitable for small batch production and supports 4 programmers for one computer.

? A wide range of chip support, the initial version supports the chip 15000+, supports a variety of 24 25 26 27 28 29 37 39 49 50 series of serial and parallel memory chips, microcontroller 51 series, ATMEL AVR ATMEGA AT90 series, MICROCHIP PIC10 PIC12 PIC16 PIC18 series microcontroller , GAL programmable logic device programming, SRAM test, 54/74 and CMOS4000 integrated circuit integrated functional test.

Support NAND Flash chip, the function is complete and comprehensive, the capacity supports to 8Gbits.

25 series Nor Flash capacity support to 512Mbits.

? Pin contact check function, poor contact pin can pinpoint

? Ultra-low power consumption: the entire programmer uses ultra-low-power chips, using USB interface, the first truly all chip programming

without external power integrated programmer. Portable performance super: the world's smallest volume, size 10CM * 6CM * 2.5CM, only the size of the driver's license.

? Programmable VCC from 1.8V to 6.5V, VPP from 1.8V to 18V chip

? Chip serial number secondary development functions: Programmer built a variety of commonly used automatic numbering function. And can use a custom algorithm to achieve any sequence number through DLL dynamic library. This feature allows you to produce

a unique identification info rmation for each chip in mass production. The logo can also be encrypted with a custom algorithm to more effectively protect your product's rights.

? Universal serial programming interface ICSP (to support both high-voltage parallel programming and low-volt age serial programming). Note: ICSP now supports 24-Series 25 Series 93 Series Serial Integrated Circuits, ATMEL89S51,52, AVR ATMEGAxxx Full

Series, and MICROCHIP PIC10Fxxx 12Fxxx 16Fxxx 18Fxxx Full Series, and the new series of SYNCMOS SM59Dxx SM59Rxx fu ll range chips for in-circuit serial programming.

? Powerful 54 / 74F / LS / HC CMOS4000 Series Integrated Functionality Tests: The First Development Programmer to Test Common Logic ICs True, Test Errors Locating Logic Gate Circuits, Test Arbitrary Possible input combinations.

1.2 Programmer chip support range

? Variety of 26 27 28 29 37 39 49 50 series of parallel ROM, EPROM, EEPROM

Fast, full support. Support TSOP32 TSOP40 TSOP48 chips to 64MBits, will join the TSOP56 pin support.

(TL866II programming voltage VPP only supports up to 18V, for early 27C series ROM, the

chip with 21V 25V VPP voltage no longer supports writing, but can be read. If it is used,

the VPP with the same type of programming voltage can be used as 13V or 12V chip replacement, for example: 27C32 21V or 13V Vpp chip,Pay attention to the VPP voltage)

? 24 25 35 45 85 93 95 Series Serial EEPROM

Serial Series Chip Support Full, Supports Chip Capacity 25 Series 8 or 16PIN to 512MBits (64M Bytes)

? NAND FLASH chip supports up to 8Gbits

? MCU series, hundreds of models of 51 series of microcomputer

? AVR microcontroller package scratch ATMEGA series ATtiny series AT90XXX series of microcontrollers, all AVR ATMEGAxxx chip also supports the ICSP interface for SPI serial download programming. Support AVR one-to-one soft-key with RC correction byte.

? MICROCHIP PIC10 PIC12 PIC16 PIC18 Series Microcontroller:

PIC series of more than 300 models, more than 900 package chip support, currently supports

one of the most complete PIC chip integrated programmer. For vario

us types of PIC monolithic, in strict accordance with the manufacturer's manual requirements, the optimal programming, programming speed is excellent. The vast majority of chips support both ISCP online programming and programming through programming sockets.

? GAL programmable logic device programming

? SRAM test

Support for common 24 61 62 DS12 series SRAM test, respectively, to data line testing,

address line testing, memory unit incremental testing and unit testing.

? Super performance 54 / 74F / LS / HC CMO

S4000 series integrated circuit integrated

Function test:

The first development-type programmer to really test common logic ICs to test for errors

that can be located to logic gates, and to test any possible combinations of inputs in an integrated circuit when testing.

Package In clude:

a. TL866CS programador con el paquete 1 pcs

b. Connect the USB cable 1 pcs

c. Softerware CD 1 pcs

24 Universal Adapter Package Contents

1. 1.8 V Adpater 1 pcs

2. TSSOP28 Adpater 1 pcs

3. TSOP32/40/48-DIP40 NAND Socket 0.5mm Adapter

4. SOIC8 SOP8 IC Flash clip 1 pcs

5. SOP44/PSOP44 Adpater 1 pcs

6. TSOP32/40/48 placa base 1 pcs

7. SOP56-DIP48 adpater 1 pcs

8. TSOP32/40/48 tablero superior de soldadura 1 pcs

9. TSOP48 adaptador 2in 1 base 1 pcs

10. TSOP40 (A) Bit placa Base 1 pcs

11. TSOP40 (B) 16bit placa base 1 pcs

12. TSOP32/40/48 tablero superior de soldadura 1 pcs

13. Adaptador 300mil SOP28-DIP28 1 pcs

14. SOP20-DIP20 Adaptador 200-208mil 1 pcs

15. SOP8-DIP8 200-208mil adpater 1 pcs

16. Adaptador 150mil SOP16-DIP16 1 pcs

17. Adaptador 150mil SOP8-DIP8 1 pcs

18. Adaptador PLCC44-DIP40 1 pcs

19. PLCC32-DIP32 1 pcs

20. Adaptador PLCC28-DIP24 1 pcs

21. Adaptador PLCC20-DIP20 1 pcs

22. SOP16/SOP14/SOP8-DIP8 adpater

23. SOP8/MSOP8/SSOP8/SOP16-DIP16 simple adaptador 1 pcs

24. Adaptador SOP8-DIP8 simples 1 pcs

25. PLCC IC Extractor 1 pcs

CH001434
€117.98

TL866II PLUS Programmer EEPROM Support NAND Flash AVR MCU GAL PIC SPI 25 Universal Adapter Extractor Clip

Intersil ISL6263CRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001435
€3.45

Intersil ISL6263CRZ