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  • Categories: Adapter, DC cable
  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

apple 339S0242

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000326
€4.77

apple 339S0242

ITE IT8718FS HXS GB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000329
€3.97

ITE IT8718F-S HXS GB

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTOCTO

PO000006
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTO/CTO

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

FAIRCHILD FAN7601N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000338
€3.45

FAIRCHILD FAN7601N

Maxim MAX1997

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000340
€3.45

Maxim MAX1997

Power supply Samsung 19V 316A 60W 55x30

Power supply Samsung 19V 3.16A [60W] 5.5x3.0

Input Voltage Range AC 100V - 240V Output DC 19V 3.16A

Connector Size 5.5mm*3.0mm Power 60W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003203
€9.95

Power supply Samsung 19V 3.16A [60W] 5.5x3.0

  • -20%

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

  • -20%

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

apple 339S0242

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000326
€4.77

apple 339S0242

ITE IT8718FS HXS GB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000329
€3.97

ITE IT8718F-S HXS GB

  • -20%

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTOCTO

PO000006
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P8400 BTO/CTO

  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
€18.00 €22.50

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

FAIRCHILD FAN7601N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000338
€3.45

FAIRCHILD FAN7601N

Maxim MAX1997

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000340
€3.45

Maxim MAX1997

Power supply Samsung 19V 316A 60W 55x30

Power supply Samsung 19V 3.16A [60W] 5.5x3.0

Input Voltage Range AC 100V - 240V Output DC 19V 3.16A

Connector Size 5.5mm*3.0mm Power 60W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003203
€9.95

Power supply Samsung 19V 3.16A [60W] 5.5x3.0