Sale High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

Description:

PCI-e X4 to M.2 NGFF Adapter

M.2 Specification Revision 0.9-3

Serial ATA Spec. Reversion 3.2

Support 2260/2280 type M.2 SSD module slot

Only Supports an M.2 Socket 3 PCI-e-based slot

Micro SATA Cables PN # M2-PCIE-1X4X

Quantity:1 Set

Features:

PCI Express PCI-E 4X Female to NGFF M.2 M Key Male Adapter Converter Card with Power Cable Allows users to use standard

PCI-e 1x/4x card in an M.2 NGFF M key slot in the Desktop or Laptop. Transparent to the operating system and does not require any software drivers

Supports data transfer up to 4.0GB/s. Supports socket 3 (M Key). One PCI-E 4X female socket and one NGFF M.2 Key M male connector available

Floppy 4 pin power connector available for stable power. 2 screw holes 2260/2280 available. Easy installation & no driver required. Supports any OS, like Windows, WinCE & Linux etc.

Function:

Allows users to use standard PCI-e 4x card in an M.2 NGFF M key slot in the Desktop or Laptop

Transparent to the operating system and does not require any software drivers

Package Included:

1 x PCI-E 4X to NGFF M.2 B+M Key Adapter Card

1 x Floppy 4 Pin to Molex Power Cable

1 x Screw

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

Input: AC 100-240V, 50-60Hz

Output: 14.85V 3.05A

Power: 45W

Connecter size: Magsafe "T "TIP 5 PIN

Condition: Brand New Replacement AC Adapter

Note: Brand New Replacement Product, works as genuine parts, 100% Compatible!!

Compatible Part Number:

A1435, A1465, A1436, A1466, MD223, MD224, MD231, MD232,MD592

Compatible Models:

MacBookAir5,1 Mid 2012: MD223LL/A (1.7 GHz Core i5)

MacBookAir5,1 Mid 2012: MD224LL/A (1.7 GHz Core i5)

MacBookAir5,1 Mid 2012: MD224LL/A (2.0 GHz Core i7)

MacBookAir6,1 Mid 2013: MD711LL/A (1.3 GHz Core i5)

MacBookAir6,1 Mid 2013: MD712LL/A (1.3 GHz Core i5)

MacBookAir6,1 Mid 2013: MD712LL/A (1.7 GHz Core i7)

MacBookAir6,1 Early 2014: MD711LL/B (1.4 GHz Core i5)

MacBookAir6,1 Early 2014: MD712LL/B (1.4 GHz Core i5)

MacBookAir6,1 Early 2014: MD712LL/B (1.7 GHz Core i7)

MacBookAir7,1 Early 2015: MJVM2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,1 Early 2015: MJVP2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBook Air 13" A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Mid 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Mid 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Mid 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBook Air MD592LL/A (Newest Version)

MacBook Air (11-inch, Early 2015)

MacBook Air (13-inch, Early 2015)

MacBook Air (11-inch, Early 2014)

MacBook Air (13-inch, Early 2014)

MacBook Air (11-inch, Mid 2013)

MacBook Air (13-inch, Mid 2013)

MacBook Air (11-inch, Mid 2012)

MacBook Air (13-inch, Mid 2012)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

USB Wireless Optical Mouse Keyboard Set

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SMC from Board 820-2610-A Maintenance Board

Samsung Exynos8895/MSM8998/S8/S8+/NOTE8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock