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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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Infineon SLB 9635 TT 12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
€3.97

Infineon SLB 9635 TT 1.2

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USB 30 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 AirPro

SSD Enclosure for 2013 to 2017 MacBook Air Pro Retina,USB 3.0 SSD Adapter with case

Description :

This product is 2013-2014-2015 MACBOOK AIR/PRO Retina ssd SSD to USB adapter, it is allowed to use SSD from 2013 2014 2015 2016 2017 Macbook SSD module through USB3.0 port on your desktop or laptop.

Features :

? Fit SSD modules only from the following Apple 2013 MACBOOK AIr PRO:

11" Air Mid 2013, A1465(MD711.MD712)

13" Air Mid 2013, A1466 (MD760.MD761)

13" PRO Retina Late 2013, A1502 (ME864, ME865, ME866)

15" PRO Retina Late 2013, A1398 (ME293, ME294, ME874)

? Fit following SSD modules:

Samsung MZ-JPU128T/0A2, MZ-JPU256T/0A2,MZ-JPU512T/0A2,MZ-KPU1T0T/0A2 Sandisk SD6PQ4M-128G

? Support Hi-Speed USB 3.0(5Gbps), PCIe Gen2 5Gb/s mass storage interface

? Extra power needed if USB3.0 port can't provide enough power supply

Note :

1. Support Sandisk SD6PQ4M-128G, SD6PQ4M-256G SSD; Support Samsung MZ-JPU128T, MZ-JPU256T, MZ-JPU512T, MZ-KPU1TOT, MZ-JPV1280.

2. DO NOT support Toshiba THNSN2128GSPS, Samsung MZ-JPV2560/5120, MZ-KPV1TOT

3. Before you buy this item,pls check if your SSD is 2013-2016 version with 12+16pin gold-pins.

Package included :

? 1x USB 3.0 to 2013 2014 2015 2016 2017 SSD Adapter Case Enclosure

? 1x USB 3.0 to mini usb cable

? 1x screwdriver

CH002232
€63.28

USB 3.0 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 Air/Pro

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SMSC LPC47N250MD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
€3.45

SMSC LPC47N250-MD

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Apple BIOS IMac 215 2011 A1311 EMC2428

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002233
€30.71

Apple BIOS IMac 21.5 2011 A1311 EMC2428

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RENESAS RJK03E1DNS HWSON8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
€3.45

RENESAS RJK03E1DNS HWSON-8

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Apple BIOS MBA13 2015 A1466 82000165 EMC2925

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002244
€32.08

Apple BIOS MBA13 2015 A1466 820-00165 EMC2925

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OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
€3.45

OZ129TN

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High Speed PCIe 1X4x Card to NGFF M2 M Key LM141XV10 PCIe Slot Adapter

Sale High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

Description:

PCI-e X4 to M.2 NGFF Adapter

M.2 Specification Revision 0.9-3

Serial ATA Spec. Reversion 3.2

Support 2260/2280 type M.2 SSD module slot

Only Supports an M.2 Socket 3 PCI-e-based slot

Micro SATA Cables PN # M2-PCIE-1X4X

Quantity:1 Set

Features:

PCI Express PCI-E 4X Female to NGFF M.2 M Key Male Adapter Converter Card with Power Cable Allows users to use standard

PCI-e 1x/4x card in an M.2 NGFF M key slot in the Desktop or Laptop. Transparent to the operating system and does not require any software drivers

Supports data transfer up to 4.0GB/s. Supports socket 3 (M Key). One PCI-E 4X female socket and one NGFF M.2 Key M male connector available

Floppy 4 pin power connector available for stable power. 2 screw holes 2260/2280 available. Easy installation & no driver required. Supports any OS, like Windows, WinCE & Linux etc.

Function:

Allows users to use standard PCI-e 4x card in an M.2 NGFF M key slot in the Desktop or Laptop

Transparent to the operating system and does not require any software drivers

Package Included:

1 x PCI-E 4X to NGFF M.2 B+M Key Adapter Card

1 x Floppy 4 Pin to Molex Power Cable

1 x Screw

CH002247
€6.09

High Speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

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IT8519GCXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000447
€3.45

IT8519G-CXS

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TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

Infineon SLB 9635 TT 12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
€3.97

Infineon SLB 9635 TT 1.2

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USB 30 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 AirPro

SSD Enclosure for 2013 to 2017 MacBook Air Pro Retina,USB 3.0 SSD Adapter with case

Description :

This product is 2013-2014-2015 MACBOOK AIR/PRO Retina ssd SSD to USB adapter, it is allowed to use SSD from 2013 2014 2015 2016 2017 Macbook SSD module through USB3.0 port on your desktop or laptop.

Features :

? Fit SSD modules only from the following Apple 2013 MACBOOK AIr PRO:

11" Air Mid 2013, A1465(MD711.MD712)

13" Air Mid 2013, A1466 (MD760.MD761)

13" PRO Retina Late 2013, A1502 (ME864, ME865, ME866)

15" PRO Retina Late 2013, A1398 (ME293, ME294, ME874)

? Fit following SSD modules:

Samsung MZ-JPU128T/0A2, MZ-JPU256T/0A2,MZ-JPU512T/0A2,MZ-KPU1T0T/0A2 Sandisk SD6PQ4M-128G

? Support Hi-Speed USB 3.0(5Gbps), PCIe Gen2 5Gb/s mass storage interface

? Extra power needed if USB3.0 port can't provide enough power supply

Note :

1. Support Sandisk SD6PQ4M-128G, SD6PQ4M-256G SSD; Support Samsung MZ-JPU128T, MZ-JPU256T, MZ-JPU512T, MZ-KPU1TOT, MZ-JPV1280.

2. DO NOT support Toshiba THNSN2128GSPS, Samsung MZ-JPV2560/5120, MZ-KPV1TOT

3. Before you buy this item,pls check if your SSD is 2013-2016 version with 12+16pin gold-pins.

Package included :

? 1x USB 3.0 to 2013 2014 2015 2016 2017 SSD Adapter Case Enclosure

? 1x USB 3.0 to mini usb cable

? 1x screwdriver

CH002232
€63.28

USB 3.0 To MAC SSD HDD Enclosure For MacBook 2013 2014 2015 2016 Air/Pro

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SMSC LPC47N250MD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
€3.45

SMSC LPC47N250-MD

wishlist
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Apple BIOS IMac 215 2011 A1311 EMC2428

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002233
€30.71

Apple BIOS IMac 21.5 2011 A1311 EMC2428

wishlist
Compare

RENESAS RJK03E1DNS HWSON8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
€3.45

RENESAS RJK03E1DNS HWSON-8

wishlist
Compare

Apple BIOS MBA13 2015 A1466 82000165 EMC2925

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002244
€32.08

Apple BIOS MBA13 2015 A1466 820-00165 EMC2925

wishlist
Compare

OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
€3.45

OZ129TN

wishlist
Compare

High Speed PCIe 1X4x Card to NGFF M2 M Key LM141XV10 PCIe Slot Adapter

Sale High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

Description:

PCI-e X4 to M.2 NGFF Adapter

M.2 Specification Revision 0.9-3

Serial ATA Spec. Reversion 3.2

Support 2260/2280 type M.2 SSD module slot

Only Supports an M.2 Socket 3 PCI-e-based slot

Micro SATA Cables PN # M2-PCIE-1X4X

Quantity:1 Set

Features:

PCI Express PCI-E 4X Female to NGFF M.2 M Key Male Adapter Converter Card with Power Cable Allows users to use standard

PCI-e 1x/4x card in an M.2 NGFF M key slot in the Desktop or Laptop. Transparent to the operating system and does not require any software drivers

Supports data transfer up to 4.0GB/s. Supports socket 3 (M Key). One PCI-E 4X female socket and one NGFF M.2 Key M male connector available

Floppy 4 pin power connector available for stable power. 2 screw holes 2260/2280 available. Easy installation & no driver required. Supports any OS, like Windows, WinCE & Linux etc.

Function:

Allows users to use standard PCI-e 4x card in an M.2 NGFF M key slot in the Desktop or Laptop

Transparent to the operating system and does not require any software drivers

Package Included:

1 x PCI-E 4X to NGFF M.2 B+M Key Adapter Card

1 x Floppy 4 Pin to Molex Power Cable

1 x Screw

CH002247
€6.09

High Speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

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IT8519GCXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000447
€3.45

IT8519G-CXS

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TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

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