• Show Sidebar

There are 1325 products.

Active filters

  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: EFI Rom Cable
  • Categories: Programmer

GF7300GSNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000335
€5.40

GF-7300GS-N-A3 Stencil Template

A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

A1347 EMC 2570 Bios Chip EFI Firmware 820-3227 Late 2012 Core i5 I53210M MD387LLA

PO000018
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3227 Late 2012 Core i5 I5-3210M MD387LL/A

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
€6.47

GK106-220-A1 Stencil Template

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

iphone7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000363
€5.72

iphone7 Stencil Template

Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
€8.58

Samsung Exynos9810/S9/S9+ Stencil Template

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

GF7300GSNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000335
€5.40

GF-7300GS-N-A3 Stencil Template

  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3227 Late 2012 Core i5 I53210M MD387LLA

PO000018
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3227 Late 2012 Core i5 I5-3210M MD387LL/A

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
€6.47

GK106-220-A1 Stencil Template

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

iphone7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000363
€5.72

iphone7 Stencil Template

Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
€8.58

Samsung Exynos9810/S9/S9+ Stencil Template

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO