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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
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A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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GK110300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000328
€6.22

GK110-300-A1 Stencil Template

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Realtek RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
€3.97

Realtek RTM862-485

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TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
€3.45

TI BQ24751ATI

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N17PG0BKCA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000332
€9.97

N17P-G0-B-KC-A1 Stencil Template 90*90

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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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GF7300GSNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000335
€5.40

GF-7300GS-N-A3 Stencil Template

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PS8407ATQFN40GTR2A1 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
€3.45

PS8407ATQFN40GTR2-A1 PARADE

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N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

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ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
€3.45

ITE IT8517VG HX0

  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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GK110300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000328
€6.22

GK110-300-A1 Stencil Template

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Compare

Realtek RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
€3.97

Realtek RTM862-485

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Compare

TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
€3.45

TI BQ24751ATI

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N17PG0BKCA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000332
€9.97

N17P-G0-B-KC-A1 Stencil Template 90*90

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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GF7300GSNA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000335
€5.40

GF-7300GS-N-A3 Stencil Template

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PS8407ATQFN40GTR2A1 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
€3.45

PS8407ATQFN40GTR2-A1 PARADE

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Compare

N2920 SR1SF Stencil Template

N2920 SR1SF Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000348
€6.22

N2920 SR1SF Stencil Template

wishlist
Compare

ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
€3.45

ITE IT8517VG HX0

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