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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
  • Categories: Programmer socket
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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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GFGO7300NA3

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000792
€24.62

GF-GO7300-N-A3

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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G86630A2 8400MGS

G86-630-A2 8400MGS

Part Number G86-630-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1246

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000796
€16.08

G86-630-A2 8400MGS

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N12PNS1SA1

N12P-NS1-S-A1

Part Number N12P-NS1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000799
€24.62

N12P-NS1-S-A1

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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DH82HM87 SR13H

DH82HM87 SR13H

Part Number DH82HM87 SR13H Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000815
€35.28

DH82HM87 SR13H

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N11PGS1A2 G330M

N11P-GS1-A2 G330M

Part Number N11P-GS1-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000825
€39.37

N11P-GS1-A2 G330M

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i7 I77Y75 BTOCTO

PO000035
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i7 I7-7Y75 BTO/CTO

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SR3JY i37130U

SR3JY i3-7130U

Part Number i3-7130U SR3JY Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-7130U SR3JY FJ8067702739765 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000829
€237.95

SR3JY i3-7130U

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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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GFGO7300NA3

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000792
€24.62

GF-GO7300-N-A3

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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G86630A2 8400MGS

G86-630-A2 8400MGS

Part Number G86-630-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1246

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000796
€16.08

G86-630-A2 8400MGS

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N12PNS1SA1

N12P-NS1-S-A1

Part Number N12P-NS1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000799
€24.62

N12P-NS1-S-A1

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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DH82HM87 SR13H

DH82HM87 SR13H

Part Number DH82HM87 SR13H Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000815
€35.28

DH82HM87 SR13H

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N11PGS1A2 G330M

N11P-GS1-A2 G330M

Part Number N11P-GS1-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000825
€39.37

N11P-GS1-A2 G330M

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i7 I77Y75 BTOCTO

PO000035
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i7 I7-7Y75 BTO/CTO

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SR3JY i37130U

SR3JY i3-7130U

Part Number i3-7130U SR3JY Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-7130U SR3JY FJ8067702739765 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000829
€237.95

SR3JY i3-7130U

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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

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