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  • Categories: Bios Chip Programming
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TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
€3.45

TI BQ24751ATI

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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PS8407ATQFN40GTR2A1 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
€3.45

PS8407ATQFN40GTR2-A1 PARADE

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
€3.45

ITE IT8517VG HX0

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3227 Late 2012 Core i5 I53210M MD387LLA

PO000018
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3227 Late 2012 Core i5 I5-3210M MD387LL/A

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

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RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
€3.45

RICHTEK RT8152A

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TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

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NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
€3.45

TI BQ24751ATI

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Compare
  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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PS8407ATQFN40GTR2A1 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
€3.45

PS8407ATQFN40GTR2-A1 PARADE

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Compare
  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
€3.45

ITE IT8517VG HX0

wishlist
Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3227 Late 2012 Core i5 I53210M MD387LLA

PO000018
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3227 Late 2012 Core i5 I5-3210M MD387LL/A

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Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

wishlist
Compare

RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
€3.45

RICHTEK RT8152A

wishlist
Compare

TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

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Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

wishlist
Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

wishlist
Compare

NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

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