N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: Download software User Manual

This is UltraHD 4K industrial camera. Resolution is 7440 x 5580 pixels. With standard HDMI and USB interface.

It can be used for education, scientific research, laboratory, demonstration, maintenance and inspection.

Feature:

Model: HY-5099

Effective Pixels: SONY IMX CMOS 1/2.3 4K SENSOR

Resolution: 4K/2K/1080P 1080P(USB)

Sensor Size: 1/2.3inch

Pixel Size: 1.55 1.55m

Image Resolution: 4608 X 3456 (16MP)

Image Format: JPEG

Lens Type: C / CS

Frame Fate: 3840 x 2160@30FPS(4K); 1080P 120@FPS; 720P 240@FPS

Output: HDMI/USB

Storage: TF Card, Max 128G

PC Support: Windows XP/7/8/10 , PC Software with Measuring Function

Image Scaling: 8-Fold zoom

Image Measurement: Support HAYEAR Measurement Software

Support Language: English/ French/ Spanish/ Portugues/ Deutsch/ Italiano/ Chinese/ Russian/ Japanese

Camera Size: 636258 mm

Package Size: 16108 cm

Package weight: 0.5Kg

Package list:

1 x 4K Microscope Camera

1 x Power supply

1 x HDMI cable

1 x USB cable

1 x Software DISC

1 x Remote Control

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

LVDS Cable for screen Lenovo G555 P/N: DC020010Y00

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ACER Aspire ONE 521 522 532 533 D255 D257 D260 D270 White US Keyboard

Part Number 521 522 532 533 D255 D257 D260 D270 Manufacturer Acer

Language US Colour White

Package/Case 100 PCS Description Original new

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502+Cable

Features:

USB can be any type of device.

AVR processor, 16 MHz.

Single pushbutton programming.

Easy to use Teensy Loader application.

Free software development tools.

Works with Mac OS X, Linux & Windows.

Tiny size, perfect for many projects.

Available with pins for solderless breadboard.

Specifications:

Chip model AT90USB1286, the ARV the SCM software developers learn the best experimental board, Bootloader program is installed, you can download the application directly by an ordinary USB interface code, very helpful for beginners SCM.

Usage: Can be directly downloaded from the Internet Flip_Installer-3.4.1 software installation, use comes with usb drive, erase, programming, and checksum. Do not need to buy another burner Pleiades expensive.

Package includes:

1set x Teensy ++ 2.0 USB AVR development board