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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer
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apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

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Apple MacBook A1534 Bottom Base Screws 5 point Pentalobe Screwdriver Screw Set Gray

Item Information:

Apple Macbook 12" Retina Bottom Base Back Cover Case Screws Set with Screw Driver

Screw Driver with two ends 1.2mm 5 point size end (P5 Pentalobe) (For MacBook 12") and 0.8mm 5 point size end (P5 Pentalobe) (For iPhone)

Compatible with Macbook 12" Retina (Early 2015 to present) - Model # A1534

This Set of screws is for Macbook 12" Retina only with Screw Driver,

if you want to buy Macbook Pro 13", 15", 17" , 13" Retina, 15" Retina & Air 11", 13", please visit my other auction or write a noted on the Paypal payment about your model.

This auction are selling 1 set of screws (8pcs per set) with Screw Driver, Macbook is not included.

CH001809
€4.35

Apple MacBook A1534 Bottom Base Screws 5 point Pentalobe Screwdriver Screw Set - Gray

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TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

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ITE IT8512E NXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000389
€3.45

ITE IT8512E NXS

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apple 338S0626

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000391
€5.56

apple 338S0626

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New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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ATHEROS AR8012BG1A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000392
€3.45

ATHEROS AR8012-BG1A

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BROADCOM BCM5248UA4KQMG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000396
€6.35

BROADCOM BCM5248UA4KQMG

apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

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Apple MacBook A1534 Bottom Base Screws 5 point Pentalobe Screwdriver Screw Set Gray

Item Information:

Apple Macbook 12" Retina Bottom Base Back Cover Case Screws Set with Screw Driver

Screw Driver with two ends 1.2mm 5 point size end (P5 Pentalobe) (For MacBook 12") and 0.8mm 5 point size end (P5 Pentalobe) (For iPhone)

Compatible with Macbook 12" Retina (Early 2015 to present) - Model # A1534

This Set of screws is for Macbook 12" Retina only with Screw Driver,

if you want to buy Macbook Pro 13", 15", 17" , 13" Retina, 15" Retina & Air 11", 13", please visit my other auction or write a noted on the Paypal payment about your model.

This auction are selling 1 set of screws (8pcs per set) with Screw Driver, Macbook is not included.

CH001809
€4.35

Apple MacBook A1534 Bottom Base Screws 5 point Pentalobe Screwdriver Screw Set - Gray

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TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

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Compare

ITE IT8512E NXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000389
€3.45

ITE IT8512E NXS

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Compare

apple 338S0626

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000391
€5.56

apple 338S0626

wishlist
Compare

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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ATHEROS AR8012BG1A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000392
€3.45

ATHEROS AR8012-BG1A

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BROADCOM BCM5248UA4KQMG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000396
€6.35

BROADCOM BCM5248UA4KQMG

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