• Show Sidebar

There are 5250 products.

Active filters

SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001581
€20.89

SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template

G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

WOLFSON WM8321

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001583
€11.12

WOLFSON WM8321

i77700HQ SR32Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001584
€8.27

i7-7700HQ SR32Q Stencil Template

SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

RICHTEK RT8203

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001587
€3.45

RICHTEK RT8203

TI BQ20Z704PW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001588
€9.53

TI BQ20Z704PW

Lattice USB download line FPGA CPLD ISP download simulation HWUSBN2A

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

CH001589
€21.01

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

TI TPS54318

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001590
€3.45

TI TPS54318

V537A426SR2FQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001591
€20.11

V537A426SR2FQ Stencil Template 90*90

ADUC834BSZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001592
€23.83

ADUC834BSZ

SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001581
€20.89

SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template

G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

WOLFSON WM8321

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001583
€11.12

WOLFSON WM8321

i77700HQ SR32Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001584
€8.27

i7-7700HQ SR32Q Stencil Template

SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

RICHTEK RT8203

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001587
€3.45

RICHTEK RT8203

TI BQ20Z704PW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001588
€9.53

TI BQ20Z704PW

Lattice USB download line FPGA CPLD ISP download simulation HWUSBN2A

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

CH001589
€21.01

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

TI TPS54318

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001590
€3.45

TI TPS54318

V537A426SR2FQ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001591
€20.11

V537A426SR2FQ Stencil Template 90*90

ADUC834BSZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001592
€23.83

ADUC834BSZ