N11P-GS1-A2 G330M

Part Number N11P-GS1-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR3JY i3-7130U

Part Number i3-7130U SR3JY Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-7130U SR3JY FJ8067702739765 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SSD Enclosure for 2013 to 2017 MacBook Air Pro Retina,USB 3.0 SSD Adapter with case

Description :

This product is 2013-2014-2015 MACBOOK AIR/PRO Retina ssd SSD to USB adapter, it is allowed to use SSD from 2013 2014 2015 2016 2017 Macbook SSD module through USB3.0 port on your desktop or laptop.

Features :

? Fit SSD modules only from the following Apple 2013 MACBOOK AIr PRO:

11" Air Mid 2013, A1465(MD711.MD712)

13" Air Mid 2013, A1466 (MD760.MD761)

13" PRO Retina Late 2013, A1502 (ME864, ME865, ME866)

15" PRO Retina Late 2013, A1398 (ME293, ME294, ME874)

? Fit following SSD modules:

Samsung MZ-JPU128T/0A2, MZ-JPU256T/0A2,MZ-JPU512T/0A2,MZ-KPU1T0T/0A2 Sandisk SD6PQ4M-128G

? Support Hi-Speed USB 3.0(5Gbps), PCIe Gen2 5Gb/s mass storage interface

? Extra power needed if USB3.0 port can't provide enough power supply

Note :

1. Support Sandisk SD6PQ4M-128G, SD6PQ4M-256G SSD; Support Samsung MZ-JPU128T, MZ-JPU256T, MZ-JPU512T, MZ-KPU1TOT, MZ-JPV1280.

2. DO NOT support Toshiba THNSN2128GSPS, Samsung MZ-JPV2560/5120, MZ-KPV1TOT

3. Before you buy this item,pls check if your SSD is 2013-2016 version with 12+16pin gold-pins.

Package included :

? 1x USB 3.0 to 2013 2014 2015 2016 2017 SSD Adapter Case Enclosure

? 1x USB 3.0 to mini usb cable

? 1x screwdriver

AC82PM45 SLB97

Part Number AC82PM45 SLB97 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1013

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GM206-250-A1 GTX950

Part Number GM206-250-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

2012 A1465 MagSafe DC I/O Power Board USB Port Audio Jack For MacBook Air 11

Model Number: 820-3213-A

Please know this fit A1465 2012 year only

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0707011 HD3470

Part Number 216-0707011 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1024

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Sale High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

Description:

PCI-e X4 to M.2 NGFF Adapter

M.2 Specification Revision 0.9-3

Serial ATA Spec. Reversion 3.2

Support 2260/2280 type M.2 SSD module slot

Only Supports an M.2 Socket 3 PCI-e-based slot

Micro SATA Cables PN # M2-PCIE-1X4X

Quantity:1 Set

Features:

PCI Express PCI-E 4X Female to NGFF M.2 M Key Male Adapter Converter Card with Power Cable Allows users to use standard

PCI-e 1x/4x card in an M.2 NGFF M key slot in the Desktop or Laptop. Transparent to the operating system and does not require any software drivers

Supports data transfer up to 4.0GB/s. Supports socket 3 (M Key). One PCI-E 4X female socket and one NGFF M.2 Key M male connector available

Floppy 4 pin power connector available for stable power. 2 screw holes 2260/2280 available. Easy installation & no driver required. Supports any OS, like Windows, WinCE & Linux etc.

Function:

Allows users to use standard PCI-e 4x card in an M.2 NGFF M key slot in the Desktop or Laptop

Transparent to the operating system and does not require any software drivers

Package Included:

1 x PCI-E 4X to NGFF M.2 B+M Key Adapter Card

1 x Floppy 4 Pin to Molex Power Cable

1 x Screw

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock