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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

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RICHTEK RT8202MZQW JJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000472
€3.45

RICHTEK RT8202MZQW JJ=

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LCD Screen Adhesive Strip Sticker Tape 2012 2013 201415 Apple iMac A1418 215

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

CH002334
€6.09

LCD Screen Adhesive Strip Sticker Tape 2012 2013 2014-15 Apple iMac A1418 21.5

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FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

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TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

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Apple BIOS MBP15 2013 A1398 8203332 EMC2673

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002398
€30.71

Apple BIOS MBP15 2013 A1398 820-3332 EMC2673

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BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

wishlist
Compare

RICHTEK RT8202MZQW JJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000472
€3.45

RICHTEK RT8202MZQW JJ=

wishlist
Compare

LCD Screen Adhesive Strip Sticker Tape 2012 2013 201415 Apple iMac A1418 215

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

CH002334
€6.09

LCD Screen Adhesive Strip Sticker Tape 2012 2013 2014-15 Apple iMac A1418 21.5

wishlist
Compare

FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

wishlist
Compare

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

wishlist
Compare

Apple BIOS MBP15 2013 A1398 8203332 EMC2673

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002398
€30.71

Apple BIOS MBP15 2013 A1398 820-3332 EMC2673

wishlist
Compare

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

wishlist
Compare

Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

wishlist
Compare
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