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i72677M SR0D2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
€5.40

i7-2677M SR0D2 Stencil Template

Teensy 20 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502+Cable

Features:

USB can be any type of device.

AVR processor, 16 MHz.

Single pushbutton programming.

Easy to use Teensy Loader application.

Free software development tools.

Works with Mac OS X, Linux & Windows.

Tiny size, perfect for many projects.

Available with pins for solderless breadboard.

Specifications:

Chip model AT90USB1286, the ARV the SCM software developers learn the best experimental board, Bootloader program is installed, you can download the application directly by an ordinary USB interface code, very helpful for beginners SCM.

Usage: Can be directly downloaded from the Internet Flip_Installer-3.4.1 software installation, use comes with usb drive, erase, programming, and checksum. Do not need to buy another burner Pleiades expensive.

Package includes:

1set x Teensy ++ 2.0 USB AVR development board

CH000617
€35.81

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

iphone5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000445
€5.72

iphone5 Stencil Template

N16EGXXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000450
€9.97

N16E-GXX-A1 Stencil Template 90*90

SR3MD Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000453
€9.97

SR3MD Stencil Template 90*90

UNO R3 Kit with Motor LCD Servo Module for Arduino AVR Starter

Package includes:

1pcs UNO R3

1pcs USB cable

1pack jumper wires

1pcs 830 Point BREADBOARD

15pcs led (Red, Green, Yellow)

30pcs resistance(220R, 10K, 1K)

1pcs 10 pin dupont line(male to female)

1pcs potentiometer

1pcs active buzzer

1pcs passive buzzer

1pcs 74HC595N

1pcs Infrared receiving head

1pcs LM35DZ

1pcs Flame sensor

2pcs Roll Ball Switch

3pcs 5mm LDR

5pcs Button Switch with Cap

1pcs IR remote control

1pcs one digital tube

1pcs four digital tube

1pcs 8*8 dot matrix tube

1pcs UNL2003 driver board

1pcs 5V stepper motor

1pcs SG90

1pcs LCD16021pcs PS2 game joystick module

1pcs DHT11 Temperature and Humidity sensor module

1pcs Water level measurement module

1pcs RFID module

1pcs RFID key ring

1pcs RFID card

1pcs sound sensor module

1pcs one road relay module

1pcs RTC module

1pcs 16 buttons matrix keyboard module

1pcs RGB three color module

1pcs 9V Battery Connector

CH000636
€35.93

UNO R3 Kit with Motor LCD Servo Module for Arduino AVR Starter

GP106300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000454
€7.46

GP106-300-A1 Stencil Template

AntiStatic Wristband Wrist Strap Band ESD Discharge PC Electricity Grounding

Product Description

1. Weight: 33g

2. Cable Length: 250cm

3. Simply wrap strap around wrist and clip to a grounded source

4. Prevent Static shock in dry environment

5. Keep static from damaging electronic parts and equipments

6. Adjustable wrist strap with alligator clip tip

7. Inner conducting layer made of stainless shell filaments

8. Durable Polyurethane Coated Coil Cords.

9. High Quality Strain relief.

10. Soft elastic band for comfort.

11. Current limiting resistor 1M ohm 5%

12. Electro-scattering time 0.1sec

13. Rinsing Resisting

CH000641
€2.70

Anti-Static Wristband Wrist Strap Band ESD Discharge PC Electricity Grounding

BD82H77 SLJ88 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000455
€5.40

BD82H77 SLJ88 Stencil Template

i72677M SR0D2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
€5.40

i7-2677M SR0D2 Stencil Template

Teensy 20 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502+Cable

Features:

USB can be any type of device.

AVR processor, 16 MHz.

Single pushbutton programming.

Easy to use Teensy Loader application.

Free software development tools.

Works with Mac OS X, Linux & Windows.

Tiny size, perfect for many projects.

Available with pins for solderless breadboard.

Specifications:

Chip model AT90USB1286, the ARV the SCM software developers learn the best experimental board, Bootloader program is installed, you can download the application directly by an ordinary USB interface code, very helpful for beginners SCM.

Usage: Can be directly downloaded from the Internet Flip_Installer-3.4.1 software installation, use comes with usb drive, erase, programming, and checksum. Do not need to buy another burner Pleiades expensive.

Package includes:

1set x Teensy ++ 2.0 USB AVR development board

CH000617
€35.81

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

iphone5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000445
€5.72

iphone5 Stencil Template

N16EGXXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000450
€9.97

N16E-GXX-A1 Stencil Template 90*90

SR3MD Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000453
€9.97

SR3MD Stencil Template 90*90

UNO R3 Kit with Motor LCD Servo Module for Arduino AVR Starter

Package includes:

1pcs UNO R3

1pcs USB cable

1pack jumper wires

1pcs 830 Point BREADBOARD

15pcs led (Red, Green, Yellow)

30pcs resistance(220R, 10K, 1K)

1pcs 10 pin dupont line(male to female)

1pcs potentiometer

1pcs active buzzer

1pcs passive buzzer

1pcs 74HC595N

1pcs Infrared receiving head

1pcs LM35DZ

1pcs Flame sensor

2pcs Roll Ball Switch

3pcs 5mm LDR

5pcs Button Switch with Cap

1pcs IR remote control

1pcs one digital tube

1pcs four digital tube

1pcs 8*8 dot matrix tube

1pcs UNL2003 driver board

1pcs 5V stepper motor

1pcs SG90

1pcs LCD16021pcs PS2 game joystick module

1pcs DHT11 Temperature and Humidity sensor module

1pcs Water level measurement module

1pcs RFID module

1pcs RFID key ring

1pcs RFID card

1pcs sound sensor module

1pcs one road relay module

1pcs RTC module

1pcs 16 buttons matrix keyboard module

1pcs RGB three color module

1pcs 9V Battery Connector

CH000636
€35.93

UNO R3 Kit with Motor LCD Servo Module for Arduino AVR Starter

GP106300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000454
€7.46

GP106-300-A1 Stencil Template

AntiStatic Wristband Wrist Strap Band ESD Discharge PC Electricity Grounding

Product Description

1. Weight: 33g

2. Cable Length: 250cm

3. Simply wrap strap around wrist and clip to a grounded source

4. Prevent Static shock in dry environment

5. Keep static from damaging electronic parts and equipments

6. Adjustable wrist strap with alligator clip tip

7. Inner conducting layer made of stainless shell filaments

8. Durable Polyurethane Coated Coil Cords.

9. High Quality Strain relief.

10. Soft elastic band for comfort.

11. Current limiting resistor 1M ohm 5%

12. Electro-scattering time 0.1sec

13. Rinsing Resisting

CH000641
€2.70

Anti-Static Wristband Wrist Strap Band ESD Discharge PC Electricity Grounding

BD82H77 SLJ88 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000455
€5.40

BD82H77 SLJ88 Stencil Template