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i72617M SR03T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000433
€5.40

i7-2617M SR03T Stencil Template

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GP107300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000434
€5.40

GP107-300-A1 Stencil Template

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3.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000585
€7.83

3.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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G98645U2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000436
€5.40

G98-645-U2 Stencil Template

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HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

Login to Download: Download software User Manual

This is UltraHD 4K industrial camera. Resolution is 7440 x 5580 pixels. With standard HDMI and USB interface.

It can be used for education, scientific research, laboratory, demonstration, maintenance and inspection.

Feature:

Model: HY-5099

Effective Pixels: SONY IMX CMOS 1/2.3 4K SENSOR

Resolution: 4K/2K/1080P 1080P(USB)

Sensor Size: 1/2.3inch

Pixel Size: 1.55 1.55m

Image Resolution: 4608 X 3456 (16MP)

Image Format: JPEG

Lens Type: C / CS

Frame Fate: 3840 x 2160@30FPS(4K); 1080P 120@FPS; 720P 240@FPS

Output: HDMI/USB

Storage: TF Card, Max 128G

PC Support: Windows XP/7/8/10 , PC Software with Measuring Function

Image Scaling: 8-Fold zoom

Image Measurement: Support HAYEAR Measurement Software

Support Language: English/ French/ Spanish/ Portugues/ Deutsch/ Italiano/ Chinese/ Russian/ Japanese

Camera Size: 636258 mm

Package Size: 16108 cm

Package weight: 0.5Kg

Package list:

1 x 4K Microscope Camera

1 x Power supply

1 x HDMI cable

1 x USB cable

1 x Software DISC

1 x Remote Control

CH000593
€197.67

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

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2160772034 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000437
€9.97

216-0772034 Stencil Template 90*90

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Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega256016AU Board For Arduino TFG

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

CH000598
€12.00

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino TFG

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i72677M SR0D2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
€5.40

i7-2677M SR0D2 Stencil Template

i72617M SR03T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000433
€5.40

i7-2617M SR03T Stencil Template

wishlist
Compare

GP107300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000434
€5.40

GP107-300-A1 Stencil Template

wishlist
Compare

3.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000585
€7.83

3.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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G98645U2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000436
€5.40

G98-645-U2 Stencil Template

wishlist
Compare

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

Login to Download: Download software User Manual

This is UltraHD 4K industrial camera. Resolution is 7440 x 5580 pixels. With standard HDMI and USB interface.

It can be used for education, scientific research, laboratory, demonstration, maintenance and inspection.

Feature:

Model: HY-5099

Effective Pixels: SONY IMX CMOS 1/2.3 4K SENSOR

Resolution: 4K/2K/1080P 1080P(USB)

Sensor Size: 1/2.3inch

Pixel Size: 1.55 1.55m

Image Resolution: 4608 X 3456 (16MP)

Image Format: JPEG

Lens Type: C / CS

Frame Fate: 3840 x 2160@30FPS(4K); 1080P 120@FPS; 720P 240@FPS

Output: HDMI/USB

Storage: TF Card, Max 128G

PC Support: Windows XP/7/8/10 , PC Software with Measuring Function

Image Scaling: 8-Fold zoom

Image Measurement: Support HAYEAR Measurement Software

Support Language: English/ French/ Spanish/ Portugues/ Deutsch/ Italiano/ Chinese/ Russian/ Japanese

Camera Size: 636258 mm

Package Size: 16108 cm

Package weight: 0.5Kg

Package list:

1 x 4K Microscope Camera

1 x Power supply

1 x HDMI cable

1 x USB cable

1 x Software DISC

1 x Remote Control

CH000593
€197.67

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

wishlist
Compare

2160772034 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000437
€9.97

216-0772034 Stencil Template 90*90

wishlist
Compare

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega256016AU Board For Arduino TFG

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

CH000598
€12.00

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino TFG

wishlist
Compare

i72677M SR0D2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
€5.40

i7-2677M SR0D2 Stencil Template

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Compare
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