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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

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N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

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NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

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A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

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N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

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A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

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BD82Z77 SLJC7

BD82Z77 SLJC7

Part Number BD82Z77 SLJC7 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000922
€32.82

BD82Z77 SLJC7

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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

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N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

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NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

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Compare
  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

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Compare

N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

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Compare
  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

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Compare

BD82Z77 SLJC7

BD82Z77 SLJC7

Part Number BD82Z77 SLJC7 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000922
€32.82

BD82Z77 SLJC7

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