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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTOCTO

PO000037
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTO/CTO

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AC82PM45 SLB97

AC82PM45 SLB97

Part Number AC82PM45 SLB97 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1013

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000830
€8.21

AC82PM45 SLB97

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A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LLA

PO000038
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LL/A

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GM206250A1 GTX950

GM206-250-A1 GTX950

Part Number GM206-250-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000831
€163.77

GM206-250-A1 GTX950

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2160707011 HD3470

216-0707011 HD3470

Part Number 216-0707011 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1024

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000835
€17.41

216-0707011 HD3470

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A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LLA

PO000039
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LL/A

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N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

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N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

  • -20%

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTOCTO

PO000037
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTO/CTO

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AC82PM45 SLB97

AC82PM45 SLB97

Part Number AC82PM45 SLB97 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1013

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000830
€8.21

AC82PM45 SLB97

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A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LLA

PO000038
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LL/A

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GM206250A1 GTX950

GM206-250-A1 GTX950

Part Number GM206-250-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000831
€163.77

GM206-250-A1 GTX950

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2160707011 HD3470

216-0707011 HD3470

Part Number 216-0707011 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1024

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000835
€17.41

216-0707011 HD3470

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A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LLA

PO000039
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LL/A

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N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

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N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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