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  • Categories: Bios Chip Programming
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Infineon SLB 9635 TT 12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
€3.97

Infineon SLB 9635 TT 1.2

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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

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SMSC LPC47N250MD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
€3.45

SMSC LPC47N250-MD

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A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTOCTO

PO000037
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTO/CTO

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RENESAS RJK03E1DNS HWSON8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
€3.45

RENESAS RJK03E1DNS HWSON-8

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A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LLA

PO000038
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LL/A

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A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LLA

PO000039
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LL/A

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OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
€3.45

OZ129TN

  • -20%
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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

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IT8519GCXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000447
€3.45

IT8519G-CXS

  • -20%
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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

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TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

Infineon SLB 9635 TT 12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
€3.97

Infineon SLB 9635 TT 1.2

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  • -20%

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

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SMSC LPC47N250MD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
€3.45

SMSC LPC47N250-MD

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  • -20%

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTOCTO

PO000037
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTO/CTO

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RENESAS RJK03E1DNS HWSON8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
€3.45

RENESAS RJK03E1DNS HWSON-8

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  • -20%

A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LLA

PO000038
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LL/A

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  • -20%

A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LLA

PO000039
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LL/A

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Compare

OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
€3.45

OZ129TN

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Compare
  • -20%

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

wishlist
Compare

IT8519GCXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000447
€3.45

IT8519G-CXS

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Compare
  • -20%

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

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Compare

TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

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