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  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
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VIA VT1211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000409
€3.45

VIA VT1211

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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RT9921GQV Richtek A9FA X18

RT9921GQV Richtek A9=FA X18

Part Number RT9921GQV Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1306

Package/Case 1500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000412
€3.45

RT9921GQV Richtek A9=FA X18

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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Maxim MAX3243

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000415
€3.45

Maxim MAX3243

  • -20%
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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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RICHTEK RT9202

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000420
€3.45

RICHTEK RT9202

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Intersil ISL95835HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000423
€3.45

Intersil ISL95835HRZ

  • -20%
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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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Winbond W25Q32FW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000426
€3.45

Winbond W25Q32FW

VIA VT1211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000409
€3.45

VIA VT1211

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Compare
  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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RT9921GQV Richtek A9FA X18

RT9921GQV Richtek A9=FA X18

Part Number RT9921GQV Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1306

Package/Case 1500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000412
€3.45

RT9921GQV Richtek A9=FA X18

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  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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Maxim MAX3243

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000415
€3.45

Maxim MAX3243

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Compare
  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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RICHTEK RT9202

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000420
€3.45

RICHTEK RT9202

wishlist
Compare

Intersil ISL95835HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000423
€3.45

Intersil ISL95835HRZ

wishlist
Compare
  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

wishlist
Compare

Winbond W25Q32FW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000426
€3.45

Winbond W25Q32FW

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