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SR215 3205U

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000745
€79.59

SR215 3205U

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

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QDFX1500MTHNA2

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000755
€35.77

QDFX-1500MT-HN-A2

  • -20%
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A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

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A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y51 MF865LLA

PO000028
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y51 MF865LL/A

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SR2Z6 N3450

SR2Z6 N3450

Part Number SR2Z6 N3450 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000757
€41.03

SR2Z6 N3450

  • -20%
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A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y71 BTOCTO

PO000029
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y71 BTO/CTO

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N10MGS2SA2 G210M

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000778
€20.18

N10M-GS2-S-A2 G210M

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2160683013 HD3650

216-0683013 HD3650

Part Number 216-0683013 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0926

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000783
€19.15

216-0683013 HD3650

  • -20%
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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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GFGO7300NA3

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000792
€24.62

GF-GO7300-N-A3

  • -20%
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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

SR215 3205U

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000745
€79.59

SR215 3205U

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  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

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QDFX1500MTHNA2

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000755
€35.77

QDFX-1500MT-HN-A2

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  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

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  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y51 MF865LLA

PO000028
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y51 MF865LL/A

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SR2Z6 N3450

SR2Z6 N3450

Part Number SR2Z6 N3450 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000757
€41.03

SR2Z6 N3450

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Compare
  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y71 BTOCTO

PO000029
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y71 BTO/CTO

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N10MGS2SA2 G210M

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000778
€20.18

N10M-GS2-S-A2 G210M

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2160683013 HD3650

216-0683013 HD3650

Part Number 216-0683013 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0926

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000783
€19.15

216-0683013 HD3650

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Compare
  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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Compare

GFGO7300NA3

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000792
€24.62

GF-GO7300-N-A3

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Compare
  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
€18.00 €22.50

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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