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apple 343S0561A1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001732
€6.35

apple 343S0561-A1

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N12EGE2A1 G555M

N12E-GE2-A1 G555M

Part Number N12E-GE2-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1042

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001733
€52.51

N12E-GE2-A1 G555M

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AM4355SHE23HJ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001734
€5.40

AM4355SHE23HJ Stencil Template

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LINEAR LT3470AED

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001735
€3.45

LINEAR LT3470AED

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2150821060 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001736
€5.40

215-0821060 Stencil Template

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RICHTEK RT8202M

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001737
€3.45

RICHTEK RT8202M

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N12PGVSA1

N12P-GV-S-A1

Part Number N12P-GV-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1152

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001738
€32.00

N12P-GV-S-A1

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DC Power Jack Part PJ049

HP Pavilion Notebook PC Series DC Power Jack Connector: TX1000 CTO, TX1000Z CTO, TX1001XX, TX1002XX, TX1003XX, TX1017AU, TX1020EA, TX1021AU, TX1030EA, TX1040EA, TX1070BR, TX1080EA, TX1110CA, TX1110US, TX1115NR, TX1119US, TX1120US, TX1127CL, TX1200 CTO, TX1201XX, TX1202AU, TX1202XX, TX1205US, TX1206AU, TX1208CA, TX1210CA, TX1210US, TX1215NR, TX1217CL, TX1218AU, TX1218CA, TX1219US, TX1220AU, TX1220CA, TX1220US, TX1228CA, TX1230LA, TX1232LA, TX1304AU, TX1304CA, TX1305AU, TX1305CA, TX1305US, TX1306NR, TX1307AU, TX1308CA, TX1308NR, TX1313AU, TX1314AU, TX1314CA, TX1315AU, TX1316AU, TX1317AU, TX1318AU, TX1318CA, TX1319AU, TX1320AU, TX1320CA, TX1320US, TX1321AU, TX1325NR, TX1327CL, TX1330LA, TX1332LA, TX1400 CTO, TX1401AU, TX1403AU, TX1404AU, TX1410US, TX1414CA, TX1416CA, TX1417CL, TX1418CA, TX1419NR, TX1420CA, TX1420US, TX1499US

HP Pavilion TX2000 Series Entertainment Notebook PC DC Power Jack Connector: TX2000 CTO, TX2000Z CTO, TX2002AU, TX2003AU, TX2005AU, TX2006AU, TX2008AU, TX2010AU, TX2013AU, TX2014AU, TX2015AU, TX2016AU, TX2018AU, TX2019AU, TX2020AU, TX2021AU, TX2023AU, TX2024AU, TX2025AU, TX2026AU, TX2027AU, TX2030AU, TX2031AU, TX2032LA, TX2033AU, TX2051XX, TX2052XX, TX2053XX, TX2054XX, TX2104AU, TX2104CA, TX2105 CTO, TX2105AU, TX2106AU, TX2107AU, TX2108AU, TX2108CA, TX2109AU, TX2110AU, TX2110CA, TX2110US, TX2113CL, TX2114CA, TX2115NR, TX2117CL, TX2120US, TX2151XX, TX2152XX, TX2500 CTO, TX2500z CTO, TX2501AU, TX2504AU, TX2507AU, TX2508AU, TX2508CA, TX2510AU, TX2510CA, TX2511AU, TX2512AU, TX2513AU, TX2513CL, TX2514AU, TX2514CA, TX2516AU, TX2517AU, TX2517CA, TX2517CL, TX2518AU, TX2519AU, TX2520AU, TX2521AU, TX2524CA, TX2525AU, TX2525NR, TX2526AU, TX2527AU, TX2528AU, TX2532AU, TX2534AU, TX2551XX, TX2552XX, TX2601AU, TX2604AU, TX2604CA, TX2605AU, TX2608AU, TX2608CA, TX2609AU, TX2610AU, TX2611AU, TX2612AU, TX2614AU, TX2615AU, TX2616AU, TX2617CA, TX2622NR, TX2623CA, TX2635US, TX2697CL

HP TouchSmart TX2 Series DC Power Jack Connector: TX2-1002AU, TX2-1012NR, TX2-1016AU, TX2-1017AU, TX2-1018AU, TX2-1019AU, TX2-1020AU, TX2-1020CA, TX2-1020US, TX2-1022AU, TX2-1024CA, TX2-1025DX, TX2-1027CA, TX2-1030CM, TX2-1031CM, TX2-1032CM, TX2-1051XX, TX2-1070BR, TX2-1102AU, TX2-1103AU, TX2-1104AU, TX2-1105AU, TX2-1106AU, TX2-1107AU, TX2-1108AU, TX2-1109AU, TX2-1110AU, TX2-1118AU, TX2-1120AU, TX2-1122AU, TX2-1205AU, TX2-1207AU, TX2-1208AU, TX2-1209AU, TX2-1270US, TX2-1274NR, TX2-1277NR, TX2-1305AU, TX2-1307AU, TX2-1308AU, TX2-1310AU, TX2-1323AU, TX2-1326AU, TX2-1370US, TX2-1375DX, TX2-1377NR, TX2z-1000 CTO, TX2Z-1300 CTO

CH001740
€7.21

DC Power Jack, Part #PJ049

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Intersil ISL88731HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001741
€3.45

Intersil ISL88731HRZ

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TI BQ20Z90x90DBTV150

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001742
€9.48

TI BQ20Z90(BQ20Z90DBT-V150)

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NUVOTON NPCE285GA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001743
€6.35

NUVOTON NPCE285GA0DX

apple 343S0561A1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001732
€6.35

apple 343S0561-A1

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N12EGE2A1 G555M

N12E-GE2-A1 G555M

Part Number N12E-GE2-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1042

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001733
€52.51

N12E-GE2-A1 G555M

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AM4355SHE23HJ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001734
€5.40

AM4355SHE23HJ Stencil Template

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LINEAR LT3470AED

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001735
€3.45

LINEAR LT3470AED

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Compare

2150821060 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001736
€5.40

215-0821060 Stencil Template

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RICHTEK RT8202M

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001737
€3.45

RICHTEK RT8202M

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N12PGVSA1

N12P-GV-S-A1

Part Number N12P-GV-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1152

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001738
€32.00

N12P-GV-S-A1

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DC Power Jack Part PJ049

HP Pavilion Notebook PC Series DC Power Jack Connector: TX1000 CTO, TX1000Z CTO, TX1001XX, TX1002XX, TX1003XX, TX1017AU, TX1020EA, TX1021AU, TX1030EA, TX1040EA, TX1070BR, TX1080EA, TX1110CA, TX1110US, TX1115NR, TX1119US, TX1120US, TX1127CL, TX1200 CTO, TX1201XX, TX1202AU, TX1202XX, TX1205US, TX1206AU, TX1208CA, TX1210CA, TX1210US, TX1215NR, TX1217CL, TX1218AU, TX1218CA, TX1219US, TX1220AU, TX1220CA, TX1220US, TX1228CA, TX1230LA, TX1232LA, TX1304AU, TX1304CA, TX1305AU, TX1305CA, TX1305US, TX1306NR, TX1307AU, TX1308CA, TX1308NR, TX1313AU, TX1314AU, TX1314CA, TX1315AU, TX1316AU, TX1317AU, TX1318AU, TX1318CA, TX1319AU, TX1320AU, TX1320CA, TX1320US, TX1321AU, TX1325NR, TX1327CL, TX1330LA, TX1332LA, TX1400 CTO, TX1401AU, TX1403AU, TX1404AU, TX1410US, TX1414CA, TX1416CA, TX1417CL, TX1418CA, TX1419NR, TX1420CA, TX1420US, TX1499US

HP Pavilion TX2000 Series Entertainment Notebook PC DC Power Jack Connector: TX2000 CTO, TX2000Z CTO, TX2002AU, TX2003AU, TX2005AU, TX2006AU, TX2008AU, TX2010AU, TX2013AU, TX2014AU, TX2015AU, TX2016AU, TX2018AU, TX2019AU, TX2020AU, TX2021AU, TX2023AU, TX2024AU, TX2025AU, TX2026AU, TX2027AU, TX2030AU, TX2031AU, TX2032LA, TX2033AU, TX2051XX, TX2052XX, TX2053XX, TX2054XX, TX2104AU, TX2104CA, TX2105 CTO, TX2105AU, TX2106AU, TX2107AU, TX2108AU, TX2108CA, TX2109AU, TX2110AU, TX2110CA, TX2110US, TX2113CL, TX2114CA, TX2115NR, TX2117CL, TX2120US, TX2151XX, TX2152XX, TX2500 CTO, TX2500z CTO, TX2501AU, TX2504AU, TX2507AU, TX2508AU, TX2508CA, TX2510AU, TX2510CA, TX2511AU, TX2512AU, TX2513AU, TX2513CL, TX2514AU, TX2514CA, TX2516AU, TX2517AU, TX2517CA, TX2517CL, TX2518AU, TX2519AU, TX2520AU, TX2521AU, TX2524CA, TX2525AU, TX2525NR, TX2526AU, TX2527AU, TX2528AU, TX2532AU, TX2534AU, TX2551XX, TX2552XX, TX2601AU, TX2604AU, TX2604CA, TX2605AU, TX2608AU, TX2608CA, TX2609AU, TX2610AU, TX2611AU, TX2612AU, TX2614AU, TX2615AU, TX2616AU, TX2617CA, TX2622NR, TX2623CA, TX2635US, TX2697CL

HP TouchSmart TX2 Series DC Power Jack Connector: TX2-1002AU, TX2-1012NR, TX2-1016AU, TX2-1017AU, TX2-1018AU, TX2-1019AU, TX2-1020AU, TX2-1020CA, TX2-1020US, TX2-1022AU, TX2-1024CA, TX2-1025DX, TX2-1027CA, TX2-1030CM, TX2-1031CM, TX2-1032CM, TX2-1051XX, TX2-1070BR, TX2-1102AU, TX2-1103AU, TX2-1104AU, TX2-1105AU, TX2-1106AU, TX2-1107AU, TX2-1108AU, TX2-1109AU, TX2-1110AU, TX2-1118AU, TX2-1120AU, TX2-1122AU, TX2-1205AU, TX2-1207AU, TX2-1208AU, TX2-1209AU, TX2-1270US, TX2-1274NR, TX2-1277NR, TX2-1305AU, TX2-1307AU, TX2-1308AU, TX2-1310AU, TX2-1323AU, TX2-1326AU, TX2-1370US, TX2-1375DX, TX2-1377NR, TX2z-1000 CTO, TX2Z-1300 CTO

CH001740
€7.21

DC Power Jack, Part #PJ049

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Intersil ISL88731HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001741
€3.45

Intersil ISL88731HRZ

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TI BQ20Z90x90DBTV150

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001742
€9.48

TI BQ20Z90(BQ20Z90DBT-V150)

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NUVOTON NPCE285GA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001743
€6.35

NUVOTON NPCE285GA0DX

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