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2160752001 SR880M HD4250

216-0752001 SR880M HD4250

Part Number 216-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001746
€41.44

216-0752001 SR880M HD4250

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PERICOM PI3LVD 1012BE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001747
€6.35

PERICOM PI3LVD 1012BE

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i57200U SR2ZU Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001748
€4.35

i5-7200U SR2ZU Stencil Template

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DC Power Jack Part PJ033

Asus A52 Series DC Power Jack Connector: A52x-xxxx, A52F, A52F-XA1, A52F-XA2, A52F-XA3, A52F-XA4, A52F-XA5, A52F-XE, A52F-XE1, A52F-XE2, A52F-XE3, A52F-XE4, A52F-XE5, A52F-XE6, A52F-XT1, A52F-XT1R, A52F-XT2, A52F-XT22

Asus A53 Series DC Power Jack Connector: A53x-xxxx, A53E, A53E-A1B, A53E-AH51, A53E-AS51, A53E-EH31, A53E-EH71, A53E-EH91, A53E-ES31, A53E-ES71, A53E-NH51, A53E-TH52, A53E-TS52, A53E-XA1, A53E-XA2, A53E-XE1, A53E-XE2, A53E-XE3, A53E-XN1, A53E-XT2, A53E-XT3, A53E-XT4, A53SV-xxxx, A53SV, A53SV-EH7, A53SV-EH71, A53SV-NH5, A53SV-NH51, A53SV-NH71, A53SV-TH71, A53SV-TH72, A53SV-XE2, A53SV-XN1, A53SV-XC1, A53SV-XE1, A53SV-XE2, A53SV-XN1, A53SV-XT1, A53SV-XT2, A53TA-xxx, A53TA, A53TA-XE2, A53TA-XN1, A53U-xxxx, A53Ux, A53U-EH11, A53U-EH21, A53U-EH22, A53U-ES01, A53U-ES11, A53U-ES21, A53U-XA1, A53U-XE1, A53U-XE2, A53U-XE3, A53U-XT2

Asus K52 Series DC Power Jack Connector: K52x-xxxx, K52F, K52F-A1, K52F-B1, K52F-BBR5, K52F-BBR9, K52F-BIN6, K52F-C1, K52F-C2B, K52F-D1, K52J, K52JB, K52JC, K52JC-A1, K52JC-B1, K52JC-X1, K52JC-X2, K52JC-XN1, K52JE, K52JE-XN1, K52JK, K52JK-A1, K52JR, K52JR-X2, K52JR-X4, K52JR-X5, K52JT, K52JT-A1, K52JT-B1, K52JT-XT1, K52JT-XT1R

Asus K53 Series DC Power Jack Connector: K53x-xxxx, K53E, K53E-BD4TD, K53E-BBR11, K53E-BBR14, K53E-BBR4, K53E-BBR7, K53E-BBR9, K53E-DH31, K53E-DH51, K53E-DH52, K53E-DH91, K53E-DS31, K53E-DS52, K53E-DS91, K53E-RBR4, K53E-RBR5, K53E-RBR9, K53E-RIN5, K53E-XB1, K53E-XB2, K53E-XR1, K53E-XR4, K53E-XQ2, K53SD-xxxx, K53SD, K53SD-DS51, K53SD-DS71, K53SD-SX039V, K53SD-SX101V, K53SD-SX111D, K53SD-SX132V, K53SD-SX504V, K53SD-SX656, K53SV-xxxx, K53SV, K53SV-A1, K53SV-B1, K53SV-DH51, K53SV-DH71, K53SV-XR1, K53SV-XR2, K53SV-XP1, K53TA-xxxx, K53TA, K53TA-A1, K53TA-BBR6, K53TA-1BSX, K53U-xxxx, K53U, K53U-A1, K53U-DH21, K53U-RBR5, K53U-RBR5, K53U-RBR7, K53U-YH21, K53U-1BSX,

Asus U52 Series DC Power Jack Connector: U52x-xxxx, U52F, U52F-BBG6, U52F-BBL5, U52F-BBL9

Asus X52 Series DC Power Jack Connector: X52x-xxx, X52F, X52F-X1, X52F-X2, X52F-X3, X52F-XF1, X52F-XF2, X52F-XR4, X52F-XR6, X52F-XR7, X52F-XR9

Fujitsu Amilo DC Power Jack Connector: M1405, M7405, Pro V2040

IBM ThinkPad X40 Series DC Power Jack Connector: X40, X41, X42, X43, X44, X45

Motion Computing DC Power Jack Connector: LE 1600

Seneca Data Nexlink Carbon 4200 Series DC Power Jack Connector: 4200, 4225

CH001749
€7.96

DC Power Jack, Part #PJ033

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SIS 962

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001752
€6.35

SIS 962

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2160811000 HD6770

216-0811000 HD6770

Part Number 216-0811000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001753
€48.76

216-0811000 HD6770

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2160752001 SR880M HD4250

216-0752001 SR880M HD4250

Part Number 216-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001754
€24.34

216-0752001 SR880M HD4250

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RICHTEK RT8015BGQW GG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001755
€3.45

RICHTEK RT8015BGQW GG=

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N12PGV3OPA1

N12P-GV3-OP-A1

Part Number N12P-GV3-OP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001756
€32.79

N12P-GV3-OP-A1

2160752001 SR880M HD4250

216-0752001 SR880M HD4250

Part Number 216-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001746
€41.44

216-0752001 SR880M HD4250

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PERICOM PI3LVD 1012BE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001747
€6.35

PERICOM PI3LVD 1012BE

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Compare

i57200U SR2ZU Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001748
€4.35

i5-7200U SR2ZU Stencil Template

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DC Power Jack Part PJ033

Asus A52 Series DC Power Jack Connector: A52x-xxxx, A52F, A52F-XA1, A52F-XA2, A52F-XA3, A52F-XA4, A52F-XA5, A52F-XE, A52F-XE1, A52F-XE2, A52F-XE3, A52F-XE4, A52F-XE5, A52F-XE6, A52F-XT1, A52F-XT1R, A52F-XT2, A52F-XT22

Asus A53 Series DC Power Jack Connector: A53x-xxxx, A53E, A53E-A1B, A53E-AH51, A53E-AS51, A53E-EH31, A53E-EH71, A53E-EH91, A53E-ES31, A53E-ES71, A53E-NH51, A53E-TH52, A53E-TS52, A53E-XA1, A53E-XA2, A53E-XE1, A53E-XE2, A53E-XE3, A53E-XN1, A53E-XT2, A53E-XT3, A53E-XT4, A53SV-xxxx, A53SV, A53SV-EH7, A53SV-EH71, A53SV-NH5, A53SV-NH51, A53SV-NH71, A53SV-TH71, A53SV-TH72, A53SV-XE2, A53SV-XN1, A53SV-XC1, A53SV-XE1, A53SV-XE2, A53SV-XN1, A53SV-XT1, A53SV-XT2, A53TA-xxx, A53TA, A53TA-XE2, A53TA-XN1, A53U-xxxx, A53Ux, A53U-EH11, A53U-EH21, A53U-EH22, A53U-ES01, A53U-ES11, A53U-ES21, A53U-XA1, A53U-XE1, A53U-XE2, A53U-XE3, A53U-XT2

Asus K52 Series DC Power Jack Connector: K52x-xxxx, K52F, K52F-A1, K52F-B1, K52F-BBR5, K52F-BBR9, K52F-BIN6, K52F-C1, K52F-C2B, K52F-D1, K52J, K52JB, K52JC, K52JC-A1, K52JC-B1, K52JC-X1, K52JC-X2, K52JC-XN1, K52JE, K52JE-XN1, K52JK, K52JK-A1, K52JR, K52JR-X2, K52JR-X4, K52JR-X5, K52JT, K52JT-A1, K52JT-B1, K52JT-XT1, K52JT-XT1R

Asus K53 Series DC Power Jack Connector: K53x-xxxx, K53E, K53E-BD4TD, K53E-BBR11, K53E-BBR14, K53E-BBR4, K53E-BBR7, K53E-BBR9, K53E-DH31, K53E-DH51, K53E-DH52, K53E-DH91, K53E-DS31, K53E-DS52, K53E-DS91, K53E-RBR4, K53E-RBR5, K53E-RBR9, K53E-RIN5, K53E-XB1, K53E-XB2, K53E-XR1, K53E-XR4, K53E-XQ2, K53SD-xxxx, K53SD, K53SD-DS51, K53SD-DS71, K53SD-SX039V, K53SD-SX101V, K53SD-SX111D, K53SD-SX132V, K53SD-SX504V, K53SD-SX656, K53SV-xxxx, K53SV, K53SV-A1, K53SV-B1, K53SV-DH51, K53SV-DH71, K53SV-XR1, K53SV-XR2, K53SV-XP1, K53TA-xxxx, K53TA, K53TA-A1, K53TA-BBR6, K53TA-1BSX, K53U-xxxx, K53U, K53U-A1, K53U-DH21, K53U-RBR5, K53U-RBR5, K53U-RBR7, K53U-YH21, K53U-1BSX,

Asus U52 Series DC Power Jack Connector: U52x-xxxx, U52F, U52F-BBG6, U52F-BBL5, U52F-BBL9

Asus X52 Series DC Power Jack Connector: X52x-xxx, X52F, X52F-X1, X52F-X2, X52F-X3, X52F-XF1, X52F-XF2, X52F-XR4, X52F-XR6, X52F-XR7, X52F-XR9

Fujitsu Amilo DC Power Jack Connector: M1405, M7405, Pro V2040

IBM ThinkPad X40 Series DC Power Jack Connector: X40, X41, X42, X43, X44, X45

Motion Computing DC Power Jack Connector: LE 1600

Seneca Data Nexlink Carbon 4200 Series DC Power Jack Connector: 4200, 4225

CH001749
€7.96

DC Power Jack, Part #PJ033

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SIS 962

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001752
€6.35

SIS 962

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Compare

2160811000 HD6770

216-0811000 HD6770

Part Number 216-0811000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001753
€48.76

216-0811000 HD6770

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Compare

2160752001 SR880M HD4250

216-0752001 SR880M HD4250

Part Number 216-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001754
€24.34

216-0752001 SR880M HD4250

wishlist
Compare

RICHTEK RT8015BGQW GG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001755
€3.45

RICHTEK RT8015BGQW GG=

wishlist
Compare

N12PGV3OPA1

N12P-GV3-OP-A1

Part Number N12P-GV3-OP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001756
€32.79

N12P-GV3-OP-A1

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