• Show Sidebar

There are 5250 products.

Active filters

wishlist
Compare
Quickview

ITE IT8585E CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001770
€5.56

ITE IT8585E CXS

wishlist
Compare
Quickview

GFGO7200NA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001772
€5.40

GF-GO7200-N-A3 Stencil Template

wishlist
Compare
Quickview

ON NTMFS4955

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001775
€3.45

ON NTMFS4955

wishlist
Compare
Quickview

Customized BGA repaired Nozzle ZhuoMao Dinghua OKI Hongten Scotle Titanium Alloy Nozzle

Buy BGA Rework Station: * Click to select model

Apply to:

ZhuoMao Hongteng ACHI Dinghua Scotie and many other BGA repaired Typhoon Nozzles can be customized to various specifications (size and pictures can be provided).

The spot models of Zhuo Mao nozzles are as follows:

10*10 15*15*20*25*25*28*28*30*30*35*35*39*40*40*41*45*45*50*55*55*60*60

Notes: Due to attribute restrictions, other specifications can not be displayed one by one. Other non-standard special air nozzles can be customized to specific specifications and sizes.

CH001777
€24.74

Customized BGA repaired Nozzle, ZhuoMao Dinghua OKI Hongten Scotle Titanium Alloy Nozzle

wishlist
Compare
Quickview

SR1SC J1900

SR1SC J1900

Part Number SR1SC J1900 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1348

Package/Case 240 PCS Description Original new

SR1SC J1900 FH8065301615009 Intel Celeron CPU BGA1170 2 0 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001780
€73.85

SR1SC J1900

wishlist
Compare
Quickview

TI BQ20864

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001781
€5.56

TI BQ20864

ITE IT8585E CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001770
€5.56

ITE IT8585E CXS

wishlist
Compare

GFGO7200NA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001772
€5.40

GF-GO7200-N-A3 Stencil Template

wishlist
Compare

ON NTMFS4955

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001775
€3.45

ON NTMFS4955

wishlist
Compare

Customized BGA repaired Nozzle ZhuoMao Dinghua OKI Hongten Scotle Titanium Alloy Nozzle

Buy BGA Rework Station: * Click to select model

Apply to:

ZhuoMao Hongteng ACHI Dinghua Scotie and many other BGA repaired Typhoon Nozzles can be customized to various specifications (size and pictures can be provided).

The spot models of Zhuo Mao nozzles are as follows:

10*10 15*15*20*25*25*28*28*30*30*35*35*39*40*40*41*45*45*50*55*55*60*60

Notes: Due to attribute restrictions, other specifications can not be displayed one by one. Other non-standard special air nozzles can be customized to specific specifications and sizes.

CH001777
€24.74

Customized BGA repaired Nozzle, ZhuoMao Dinghua OKI Hongten Scotle Titanium Alloy Nozzle

wishlist
Compare

LVDS Cable Asus K53U

LVDS Cable Asus K53U

Part Number Asus K53U Manufacturer ASUS

BGA Alloy LVDS Cable Date Code 16+

Package/Case 1 PCS Description Original new

CH001779
€14.88

LVDS Cable Asus K53U

wishlist
Compare

SR1SC J1900

SR1SC J1900

Part Number SR1SC J1900 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1348

Package/Case 240 PCS Description Original new

SR1SC J1900 FH8065301615009 Intel Celeron CPU BGA1170 2 0 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001780
€73.85

SR1SC J1900

wishlist
Compare

TI BQ20864

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001781
€5.56

TI BQ20864

wishlist
Compare
Back to top