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  • Brand: Andk Kzt Hmilu
  • Brand: Chipsetpro.com
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  • Brand: Winbond & Macronix
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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
€22.01

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit and Adapter Socket

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
€180.51

SR2EU i3-6100U

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Apple adapter repair cable 45W 60W 85W Magsafe 1

Description

NEW Cord for you repair the MagSafe Power Adapter.

Length: 5.5 Feet.

100% Brand New.

Attention

Magsafe 1 Compatible with the MacBook Air Pro Before 2012 year

Magsafe 2 Compatible with the MacBook Air Pro After 2012 year

Compatible for all 45W 85W 60W AC Power Adapter of Apple:

Apple 14.5V3.1A Rectangular-shaped 5-pin Magnet

Apple 14.5V3.1A Square-shaped 5-pin Magnet

Apple 16.5V3.65A Rectangular-shaped 5-pin Magnet

Apple 16.5V3.65A Square-shaped 5-pin Magnet

Apple 18.5V4.6A Rectangular-shaped 5-pin Magnet

Apple 18.5V4.6A Square-shaped 5-pin Magnet

CH000256
€6.59

Apple adapter repair cable 45W 60W 85W Magsafe 1

BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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Compare

ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

wishlist
Compare

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
€22.01

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit and Adapter Socket

wishlist
Compare

TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

wishlist
Compare

GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

wishlist
Compare

SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
€180.51

SR2EU i3-6100U

wishlist
Compare

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

wishlist
Compare

Apple adapter repair cable 45W 60W 85W Magsafe 1

Description

NEW Cord for you repair the MagSafe Power Adapter.

Length: 5.5 Feet.

100% Brand New.

Attention

Magsafe 1 Compatible with the MacBook Air Pro Before 2012 year

Magsafe 2 Compatible with the MacBook Air Pro After 2012 year

Compatible for all 45W 85W 60W AC Power Adapter of Apple:

Apple 14.5V3.1A Rectangular-shaped 5-pin Magnet

Apple 14.5V3.1A Square-shaped 5-pin Magnet

Apple 16.5V3.65A Rectangular-shaped 5-pin Magnet

Apple 16.5V3.65A Square-shaped 5-pin Magnet

Apple 18.5V4.6A Rectangular-shaped 5-pin Magnet

Apple 18.5V4.6A Square-shaped 5-pin Magnet

CH000256
€6.59

Apple adapter repair cable 45W 60W 85W Magsafe 1

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Compare
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