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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

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LCD Screen Adhesive Strip Sticker Tape 2012 2013 201415 Apple iMac A1418 215

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

CH002334
€6.09

LCD Screen Adhesive Strip Sticker Tape 2012 2013 2014-15 Apple iMac A1418 21.5

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N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

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NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

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Apple BIOS MBP15 2013 A1398 8203332 EMC2673

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002398
€30.71

Apple BIOS MBP15 2013 A1398 820-3332 EMC2673

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N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

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BD82Z77 SLJC7

BD82Z77 SLJC7

Part Number BD82Z77 SLJC7 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000922
€32.82

BD82Z77 SLJC7

N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

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LCD Screen Adhesive Strip Sticker Tape 2012 2013 201415 Apple iMac A1418 215

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

CH002334
€6.09

LCD Screen Adhesive Strip Sticker Tape 2012 2013 2014-15 Apple iMac A1418 21.5

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N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

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NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

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Compare

Apple BIOS MBP15 2013 A1398 8203332 EMC2673

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002398
€30.71

Apple BIOS MBP15 2013 A1398 820-3332 EMC2673

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N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

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BD82Z77 SLJC7

BD82Z77 SLJC7

Part Number BD82Z77 SLJC7 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000922
€32.82

BD82Z77 SLJC7

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