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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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SR0HZ

SR0HZ

Part Number SR0HZ Manufacturer INTEL

Socket Type rPGA988B Date Code 12+

Package/Case 1 PCS Description Brand new

SR0HZ FF8062701159901 B815 Mobile Celeron Dual-Core 1.6 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000943
€10.50

SR0HZ

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CMC50AFPB22GT C50

CMC50AFPB22GT C-50

Part Number CMC50AFPB22GT Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Original new

CMC50AFPB22GT C-50 Processor for Laptop AMD C-Series BGA413 1.0 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000948
€26.73

CMC50AFPB22GT C-50

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SR342 i57200U

SR342 i5-7200U

Part Number i5-7200U SR342 Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000960
€237.95

SR342 i5-7200U

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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G94700A1

G94-700-A1

Part Number G94-700-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0837

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000974
€36.10

G94-700-A1

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2160707009 HD3470

216-0707009 HD3470

Part Number 216-0707009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1025

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000979
€29.57

216-0707009 HD3470

  • -20%
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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

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2160732026

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1143

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000985
€43.53

216-0732026

  • -20%
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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

  • -20%
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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

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MCP67MDA2

MCP67MD-A2

Part Number MCP67MD-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0733

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000989
€66.46

MCP67MD-A2

  • -20%
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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i7 I73667U MD846LLA

PO000055
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i7 I7-3667U MD846LL/A

SR0HZ

SR0HZ

Part Number SR0HZ Manufacturer INTEL

Socket Type rPGA988B Date Code 12+

Package/Case 1 PCS Description Brand new

SR0HZ FF8062701159901 B815 Mobile Celeron Dual-Core 1.6 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000943
€10.50

SR0HZ

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CMC50AFPB22GT C50

CMC50AFPB22GT C-50

Part Number CMC50AFPB22GT Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Original new

CMC50AFPB22GT C-50 Processor for Laptop AMD C-Series BGA413 1.0 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000948
€26.73

CMC50AFPB22GT C-50

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SR342 i57200U

SR342 i5-7200U

Part Number i5-7200U SR342 Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000960
€237.95

SR342 i5-7200U

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  • -20%

A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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G94700A1

G94-700-A1

Part Number G94-700-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0837

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000974
€36.10

G94-700-A1

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2160707009 HD3470

216-0707009 HD3470

Part Number 216-0707009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1025

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000979
€29.57

216-0707009 HD3470

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  • -20%

A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

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2160732026

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1143

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000985
€43.53

216-0732026

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Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

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  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

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MCP67MDA2

MCP67MD-A2

Part Number MCP67MD-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0733

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000989
€66.46

MCP67MD-A2

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  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i7 I73667U MD846LLA

PO000055
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i7 I7-3667U MD846LL/A

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