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G94650A1 9600MGS

G94-650-A1 9600MGS

Part Number G94-650-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0910

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000704
€36.92

G94-650-A1 9600MGS

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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

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G96632C1 9600MGT

G96-632-C1 9600MGT

Part Number G96-632-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000708
€30.03

G96-632-C1 9600MGT

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

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AF82801JIB SLB8R

AF82801JIB SLB8R

Part Number AF82801JIB SLB8R Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1130

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000733
€14.77

AF82801JIB SLB8R

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Mechanic VC04 VCC power supply short circuit delector

A. Welcome To Choose The Production-MECHANIC

This manual will guide you how to use the production. MECHANIC reserves the right of final interpretation, including the manual, the three-package certificate and related materials.

Executive standard:DL/T 856-2018,GB/T 17478-2004

Information in this manual is subject to change without notice.

B. Product List

? Host *1

? Type-C Cable *1

? Insulated Crocodile Clips/Multimeter Pen Probe Test Cable *1

? Instructions *1

C. Function Description

This product develops a safe and efficient detector according to the maintenance master's understanding of the mainboard circuit power supply system, in which quickly troubleshooting for short circuit components of power supply cable in mainboard circuit, it contains four models (1.2V/1.8V/3.0V/3.8V) accurate voltage, current display,Built-in lithium battery, external charging port, It is a necessary tool for maintenance master to test the circuit of mobile phone.

D. Parameter

(Host Size) :85*55*35mm

(Voltage Mode) : 1.2V/1.8V/3.0V/3.8V (4 Types)

(Current): 25A (Max)

(Power) :100W (Max)

(Charging Port): Type-C(DC 5V/1A.4 hrs full charge)

(Work Time) :168 hrs

E. Operation Method

1. Turn on the power.

2. Select testing model(1.2V/1.8V/3.0V/3.8V).

3. The black crocodile clamps the negative electrode and positive connection test circuit.

4. Press the start button to complete.

F. Attention

Please pay attention to low voltage circuit, do not use overload voltage for circuit test, high voltage test low voltage circuit, may burn low voltage circuit components, please use similar or the same voltage gear for circuit test.

G. Warranty

Thank you for choosing this type of products, please read the following terms before using:

1. From purchasing date within 7 days, under normal use(Non-artificial damage),new package,not be disassemble and repaired .enjoy replacement service.

2. From purchasing date within one year, under normal use, if there are quality problem, not bedisassemble and repaired .enjoy free repair service.

3. For more than warranty, we provide a lifetime warranty service, free of labor costs, chargeonly spare parts costs.

4. Failure to present warranty card during warranty period, the company will not be a free service.

5. Users need warranty service, please contact your original sales unit.

6. When users need warranty service, please provide warranty card and purchase invoice, orreceipt of the certificate of the company seal.

7. Warranty does not include transportation costs and provide on-site service.

Note: This product contains a built-in battery

CH002499
€51.97

Mechanic VC04 VCC power supply short circuit delector

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SR1EB i74510U

SR1EB i7-4510U

Part Number SR1EB i7-4510U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1330

Package/Case 440 PCS Description Original new

SR1EB i7-4510U CL8064701477301 Intel Core i7 Mobile CPU BGA1168 2.0 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000737
€195.28

SR1EB i7-4510U

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

G94650A1 9600MGS

G94-650-A1 9600MGS

Part Number G94-650-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0910

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000704
€36.92

G94-650-A1 9600MGS

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Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

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G96632C1 9600MGT

G96-632-C1 9600MGT

Part Number G96-632-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000708
€30.03

G96-632-C1 9600MGT

wishlist
Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

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Compare

AF82801JIB SLB8R

AF82801JIB SLB8R

Part Number AF82801JIB SLB8R Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1130

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000733
€14.77

AF82801JIB SLB8R

wishlist
Compare

Mechanic VC04 VCC power supply short circuit delector

A. Welcome To Choose The Production-MECHANIC

This manual will guide you how to use the production. MECHANIC reserves the right of final interpretation, including the manual, the three-package certificate and related materials.

Executive standard:DL/T 856-2018,GB/T 17478-2004

Information in this manual is subject to change without notice.

B. Product List

? Host *1

? Type-C Cable *1

? Insulated Crocodile Clips/Multimeter Pen Probe Test Cable *1

? Instructions *1

C. Function Description

This product develops a safe and efficient detector according to the maintenance master's understanding of the mainboard circuit power supply system, in which quickly troubleshooting for short circuit components of power supply cable in mainboard circuit, it contains four models (1.2V/1.8V/3.0V/3.8V) accurate voltage, current display,Built-in lithium battery, external charging port, It is a necessary tool for maintenance master to test the circuit of mobile phone.

D. Parameter

(Host Size) :85*55*35mm

(Voltage Mode) : 1.2V/1.8V/3.0V/3.8V (4 Types)

(Current): 25A (Max)

(Power) :100W (Max)

(Charging Port): Type-C(DC 5V/1A.4 hrs full charge)

(Work Time) :168 hrs

E. Operation Method

1. Turn on the power.

2. Select testing model(1.2V/1.8V/3.0V/3.8V).

3. The black crocodile clamps the negative electrode and positive connection test circuit.

4. Press the start button to complete.

F. Attention

Please pay attention to low voltage circuit, do not use overload voltage for circuit test, high voltage test low voltage circuit, may burn low voltage circuit components, please use similar or the same voltage gear for circuit test.

G. Warranty

Thank you for choosing this type of products, please read the following terms before using:

1. From purchasing date within 7 days, under normal use(Non-artificial damage),new package,not be disassemble and repaired .enjoy replacement service.

2. From purchasing date within one year, under normal use, if there are quality problem, not bedisassemble and repaired .enjoy free repair service.

3. For more than warranty, we provide a lifetime warranty service, free of labor costs, chargeonly spare parts costs.

4. Failure to present warranty card during warranty period, the company will not be a free service.

5. Users need warranty service, please contact your original sales unit.

6. When users need warranty service, please provide warranty card and purchase invoice, orreceipt of the certificate of the company seal.

7. Warranty does not include transportation costs and provide on-site service.

Note: This product contains a built-in battery

CH002499
€51.97

Mechanic VC04 VCC power supply short circuit delector

wishlist
Compare

SR1EB i74510U

SR1EB i7-4510U

Part Number SR1EB i7-4510U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1330

Package/Case 440 PCS Description Original new

SR1EB i7-4510U CL8064701477301 Intel Core i7 Mobile CPU BGA1168 2.0 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000737
€195.28

SR1EB i7-4510U

wishlist
Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

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Compare
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