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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
  • Categories: Other BGA Chips & ICs
  • Categories: PCI, CPU Socket Tester
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BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

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Maxim MAX1772EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000360
€3.45

Maxim MAX1772EEI

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

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N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

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Realtek RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
€3.97

Realtek RTM862-485

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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
€57.44

SR2KL N3710

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
€3.45

TI BQ24751ATI

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
€32.00

GF-GO7200T-N-A3

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PS8407ATQFN40GTR2A1 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
€3.45

PS8407ATQFN40GTR2-A1 PARADE

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

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Maxim MAX1772EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000360
€3.45

Maxim MAX1772EEI

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A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

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N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

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Realtek RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
€3.97

Realtek RTM862-485

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
€57.44

SR2KL N3710

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
€3.45

TI BQ24751ATI

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
€32.00

GF-GO7200T-N-A3

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PS8407ATQFN40GTR2A1 PARADE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000373
€3.45

PS8407ATQFN40GTR2-A1 PARADE

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