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N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

OBDSTAR RT100 Remote Tester FrequencyInfrared

OBDSTAR RT100 Remote Tester Frequency/Infrared

OBDSTAR RT100 Remote Tester Frequency Infrared (IR) can detect frequency of car remote control as well as the infrared is working or not, which helps a lot in key programming and car maintenance.

OBDSTAR RT100 Features:

1. Portable Design

2. Easy Operation

3. Screen Display

4. Reliable Data

OBDSTAR RT100 Frequency Test Range:

300Mhz-320Mhz

434Mhz

868Mhz

Way to Test Frequency:

1. Power on the device

2. Put the remote control close to the device

3. Press any button on the remote control

4. The lit indicator shows the frequency

Way to Test Infrared Working or not:

The infrared works well if the indicator lits up after pressing the key button,otherwise,it is in malfunction

Package includes:

1pc x OBDSTAR RT100 Remote Tester Frequency/Infrared

CH001126
€49.48

OBDSTAR RT100 Remote Tester Frequency/Infrared

NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2

N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

OBDSTAR RT100 Remote Tester FrequencyInfrared

OBDSTAR RT100 Remote Tester Frequency/Infrared

OBDSTAR RT100 Remote Tester Frequency Infrared (IR) can detect frequency of car remote control as well as the infrared is working or not, which helps a lot in key programming and car maintenance.

OBDSTAR RT100 Features:

1. Portable Design

2. Easy Operation

3. Screen Display

4. Reliable Data

OBDSTAR RT100 Frequency Test Range:

300Mhz-320Mhz

434Mhz

868Mhz

Way to Test Frequency:

1. Power on the device

2. Put the remote control close to the device

3. Press any button on the remote control

4. The lit indicator shows the frequency

Way to Test Infrared Working or not:

The infrared works well if the indicator lits up after pressing the key button,otherwise,it is in malfunction

Package includes:

1pc x OBDSTAR RT100 Remote Tester Frequency/Infrared

CH001126
€49.48

OBDSTAR RT100 Remote Tester Frequency/Infrared

NFG6150NA2

NF-G6150-N-A2

Part Number NF-G6150-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000878
€27.87

NF-G6150-N-A2

N15SGTSA2

N15S-GT-S-A2

Part Number N15S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000890
€27.08

N15S-GT-S-A2