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  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer socket
  • Availability: In stock

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

ITE IT8512F EXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000482
€3.45

ITE IT8512F (EXS)

ENE KB9016QF A3

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000485
€3.97

ENE KB9016QF A3

  • -20%

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

  • -20%

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

  • -20%

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

ITE IT8512F EXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000482
€3.45

ITE IT8512F (EXS)

ENE KB9016QF A3

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000485
€3.97

ENE KB9016QF A3