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2160769024 HD5850

216-0769024 HD5850

Part Number 216-0769024 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1128

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001782
€62.69

216-0769024 HD5850

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N13PGTA2 GT630M

N13P-GT-A2 GT630M

Part Number N13P-GT-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1249

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001783
€57.44

N13P-GT-A2 GT630M

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ON NTMFS4707NT1G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001784
€3.45

ON NTMFS4707NT1G

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Maxim MAX17017

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001785
€5.56

Maxim MAX17017

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NUVOTON NPCE985LB1DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001786
€12.71

NUVOTON NPCE985LB1DX

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iphone6 PLUS Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001787
€5.72

iphone6 PLUS Stencil Template

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DC Power Jack Part PJ016

Acer Aspire DC Power Jack Connector: 1350

Acer Ferrari DC Power Jack Connector: 3000, 3000LMI, 3200, 3400, 4000

Acer Travlemate DC Power Jack Connector: 2700, 4500

Asus DC Power Jack Connector: A2500H Series

Chembook DC Power Jack Connector: CQ12-15

Dell Inspiron DC Power Jack Connector: 1000, 1200, 1300, 2000, 2200, B120, B130

Medion DC Power Jack Connector: E6214

Toshiba Satellite DC Power Jack Connector: 1130 Series, 1135 Series, 2430 Series, 2435 Series

Packard Bell EasyNote: C3 Series, C3205, C3223, C3227, C3255, C3265, C3300, C3302

CH001788
€7.21

DC Power Jack, Part #PJ016

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2160836036 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001789
€17.14

216-0836036 Stencil Template 90*90

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BROADCOM BCM4325

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001790
€7.94

BROADCOM BCM4325

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RT300M SmartFit Voltage LED LCD TV Laptop Backlight Tester Tool Special Tweezer

Login to Download: * RT300M LED Tester Specification

Description:

iFiX RT300M tester is universal Voltage LED LCD TV Laptop Backlight Tester Tool, Smart LED Tester LED Strip Test Tool with Current and Voltage Display, Universal LED light bulb lamp tester tool for repair laptop / TV.

Specifications:

Input voltage: AC 90 ~ 265V

Output voltage: DC 0 ~ 300V

Output current: DC 0 ~ 300mA

Function:

Smart identification between lamp bead and light bar, anode and cathode, which protect the lamp bead from burning out After finishing test for 30S, enter sleep mode without electric shock,

Short connect the probes to wake. Available for smart and infinite adjustment at 300mA wide current range Short connect probes for 3S, adjust the maximum constant current value at 1-300mA.

Package including:

1 x LED LCD TV Backlight Tester

2 x Table pen

1 x LED Special Test Clip

1 x User guide

CH001792
€34.69

RT300M Smart-Fit Voltage LED LCD TV Laptop Backlight Tester Tool + Special Tweezer

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N3450 SR2Z6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001793
€9.82

N3450 SR2Z6 Stencil Template 90*90

2160769024 HD5850

216-0769024 HD5850

Part Number 216-0769024 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1128

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001782
€62.69

216-0769024 HD5850

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N13PGTA2 GT630M

N13P-GT-A2 GT630M

Part Number N13P-GT-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1249

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001783
€57.44

N13P-GT-A2 GT630M

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ON NTMFS4707NT1G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001784
€3.45

ON NTMFS4707NT1G

wishlist
Compare

Maxim MAX17017

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001785
€5.56

Maxim MAX17017

wishlist
Compare

NUVOTON NPCE985LB1DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001786
€12.71

NUVOTON NPCE985LB1DX

wishlist
Compare

iphone6 PLUS Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001787
€5.72

iphone6 PLUS Stencil Template

wishlist
Compare

DC Power Jack Part PJ016

Acer Aspire DC Power Jack Connector: 1350

Acer Ferrari DC Power Jack Connector: 3000, 3000LMI, 3200, 3400, 4000

Acer Travlemate DC Power Jack Connector: 2700, 4500

Asus DC Power Jack Connector: A2500H Series

Chembook DC Power Jack Connector: CQ12-15

Dell Inspiron DC Power Jack Connector: 1000, 1200, 1300, 2000, 2200, B120, B130

Medion DC Power Jack Connector: E6214

Toshiba Satellite DC Power Jack Connector: 1130 Series, 1135 Series, 2430 Series, 2435 Series

Packard Bell EasyNote: C3 Series, C3205, C3223, C3227, C3255, C3265, C3300, C3302

CH001788
€7.21

DC Power Jack, Part #PJ016

wishlist
Compare

2160836036 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001789
€17.14

216-0836036 Stencil Template 90*90

wishlist
Compare

BROADCOM BCM4325

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001790
€7.94

BROADCOM BCM4325

wishlist
Compare

RT300M SmartFit Voltage LED LCD TV Laptop Backlight Tester Tool Special Tweezer

Login to Download: * RT300M LED Tester Specification

Description:

iFiX RT300M tester is universal Voltage LED LCD TV Laptop Backlight Tester Tool, Smart LED Tester LED Strip Test Tool with Current and Voltage Display, Universal LED light bulb lamp tester tool for repair laptop / TV.

Specifications:

Input voltage: AC 90 ~ 265V

Output voltage: DC 0 ~ 300V

Output current: DC 0 ~ 300mA

Function:

Smart identification between lamp bead and light bar, anode and cathode, which protect the lamp bead from burning out After finishing test for 30S, enter sleep mode without electric shock,

Short connect the probes to wake. Available for smart and infinite adjustment at 300mA wide current range Short connect probes for 3S, adjust the maximum constant current value at 1-300mA.

Package including:

1 x LED LCD TV Backlight Tester

2 x Table pen

1 x LED Special Test Clip

1 x User guide

CH001792
€34.69

RT300M Smart-Fit Voltage LED LCD TV Laptop Backlight Tester Tool + Special Tweezer

wishlist
Compare

N3450 SR2Z6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001793
€9.82

N3450 SR2Z6 Stencil Template 90*90

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Compare
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